Patents Represented by Attorney Hiscock & Berclay, LLP

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  • Folded leadframe multiple die package
    Patent number: 8198710
    Abstract: A multiple die package includes a folded leadframe for interconnecting at least two die attached to another leadframe. In a synchronous voltage regulator the folded leadframe, which is formed from a single piece of material, connects the high side switching device with the low side switching device to provide a low resistance, low inductance connection between the two devices.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: June 12, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yong Liu, Tiburcio A. Maldo, Hua Yang