Abstract: A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions disposed on opposite sides of the flexible insulating sheet that form a contact channel region that retains a rim portion surrounding an opening. The electrical connector provides a flexible carrier for the contacts to conform to irregular mating surfaces of components to be joined. For a given contact height, the electrical connector further provides a minimum electrical path length for components connected by the contacts board. In one aspect, the metallic contacts including at least one side containing elastic portions are formed from sheets of conductive material. In one aspect, circular shaped contacts are singulated after opposing conductive sheets are joined in regions within the openings of the flexible insulating sheet.

Abstract: A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable connector for high speed, high performance electronic circuitry and semiconductors. The electrical connector can be used to make, for example, electrical connections from components such as a Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device. A normalized working range for an array of elastic contacts of the interposer can be about 0.2 to 1.0. A reversible normalized working range is maintained through multiple connections and reconnections using a highly elastic material for the contact arms. In one aspect, a first electrical component having a first array pitch can be connected to a second electrical component having a second array pitch.

Abstract: An architecture for increasing the normalized working range of connectors having arrays of small contacts. One configuration includes a plurality of pairs of opposed contacts that are arranged in a staggered fashion. The opposed contacts are configured to engage an external contact array in a staggered fashion. The contact arm length of elastic contacts can be substantially greater than the effective array pitch of the plurality of pairs of opposed contacts. Accordingly, the vertical displacement range of three dimensional contacts formed in the connector can be much greater than for in-line contact arrangements.

Abstract: An electrical interposer including first and second surfaces is provided. A plurality of compliant pins are connected to the first surface of the substrate, each of the compliant pins having a drawn body with at least one side wall extending along a longitudinal axis thereof substantially perpendicular to the substrate. A plurality of contact elements are connected to the substrate for making electrical contact with a device facing the second surface of the substrate. Electrical paths connect the compliant pins to the contact elements.

Abstract: A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one sidewall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one sidewall and is bent such that at least a portion of the at least one spring member extends beyond the rim.

Abstract: A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.