Abstract: A component is mounted to a circuit board by covering a section of the board's conductive pads with a nonconductive mask. It is also possible to plate additional conductive material onto the pads before applying the mask. The component's contacts are soldered to the uncovered sections of the pads or plating.
Type:
Grant
Filed:
April 30, 1992
Date of Patent:
November 17, 1992
Assignee:
Allied-Signal Inc.
Inventors:
Michael J. Mencik, Richard P. Lambert, Jr., Helmut Matheis, Donald K. Swenson