Patents Represented by Attorney, Agent or Law Firm Howard G. Walter
  • Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
    Patent number: 6271102
    Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: August 7, 2001
    Assignee: International Business Machines Corporation
    Inventors: Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson