Abstract: A polishing apparatus for polishing a substrate. The polishing apparatus has a slurry delivery system for delivering slurry to the apparatus; a porous polishing pad having an upper surface at which the substrate is polished; and a rotating platen upon which the porous pad lies. The rotating platen has a recess which has a first portion in communication with the delivery means for delivering slurry into the first portion. The recess further has a second portion extending under the polishing pad. Slurry is delivered from the first portion to the second portion and to the upper surface of the pad where it aids in the polishing of the substrate. Preferably, the first portion of the recess is situated such that the slurry delivered to the top surface returns to the first portion for removal or reuse due to the rotational force of the rotating platen.

Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure comprising a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.

Abstract: A method for forming a semiconductor structure includes supplying a structure having an exposed last metalization layer, cleaning the last metalization layer, forming a silicide in a top portion of the last metalization layer and forming a terminal over the silicide.

Abstract: A temperature control fixture for an integrated circuit under test which provides for heating or cooling of the back side of the integrated circuit while it is being tested by contacts and electrical leads applied to the opposite lead side thereof. A test housing defines a sealed test chamber within which a test mounting is provided for mounting the integrated circuit under test. The test mounting is connected to a plurality of test lines for conducting test signals between the lead side of the integrated circuit and a test instrument external to the test apparatus. The integrated circuit is mounted on the test mounting to expose the back side thereof to a flow of a heat transfer medium in the sealed test chamber to provide for cooling or heating thereof. An observation window in the test housing enables observation of the back side of device during testing.