Abstract: A tread belt is molded and cured in a mold having a base plate and an inverted cup-shaped top plate. A plurality of inner segments are disposed in the mold. When the mold is closed outer surfaces of the inner segments form a cylindrical surface which is in contact with an inner surface of the tread belt. A first portion of the inner segments are follower segments, a second portion of the inner segments are leader segments, and means are provided for controlling radial movement of the inner segments. A plurality of outer segments are disposed in the mold. When the mold is closed the inner surfaces of the outer segments form a cylindrical surface which is in contact with an outer surface of the tread belt, and means are provided for controlling movement of the outer segments.

Abstract: According to the invention, compositions of Ni—Ti—Pt high temperature, high force, shape memory alloys are disclosed that have transition temperatures above 100° C.; have narrow hysteresis; and produce a high specific work output.

Abstract: The present invention is an apparatus and method for producing very large area and large volume plasmas. The invention utilizes electron cylcotron resonances in conjunction with permanent magnets to produce dense, uniform plasmas for long life ion thruster applications or for plasma processing applications such as etching, deposition, ion milling and ion implantation. The large area source is at least five times larger than the 12-inch wafers being processed to date. Its rectangular shape makes it easier to accommodate to materials processing than sources that are circular in shape. The source itself represents the largest ECR ion source built to date. It is electrodeless and does not utilize electromagnets to generate the ECR magnetic circuit, nor does it make use of windows.

Abstract: A method and system for controlling access to computer resources by multiple software components is described. A locker manager is provided, which is adapted to manage access to shared computer resources by independent software components. If a particular hardware resource is not currently being used and is available, the locker manager grants a particular software component access to the particular computer resource and locks access thereto, wherein none of the other software components can access the particular computer resource until the particular software component has finished accessing the particular computer resource.

Abstract: An improved method for performing an improved Temporary Chip Attach utilizing an Injection Molded Solder (IMS) process to allow efficient testing of die for creating a Known Good Die Bank. The IMS is applied to the testing substrate to form a column on the substrate. The die to be tested can then be attached to the IMS column with C4 solder. A slight reflow is then applied to the die, allowing some of the C4 to melt, and form an electrical connection with the corresponding IMS column. After testing, the die can be removed along with the C4 from the IMS column or permanently attached the substrate by performing a full reflow of the C4.

Abstract: A Unitized Regenerative Fuel Cell system uses heat pipes to convey waste heat from the fuel cell stack to the reactant storage tanks. The storage tanks act as heat sinks/sources and as passive radiators of the waste heat from the fuel cell stack. During charge up, i.e., the electrolytic process, gases are conveyed to the reactant storage tanks by way of tubes that include dryers. Reactant gases moving through the dryers give up energy to the cold tanks, causing water vapor in with the gases to condense and freeze on the internal surfaces of the dryer. During operation in its fuel cell mode, the heat pipes convey waste heat from the fuel cell stack to the respective reactant storage tanks, thereby heating them such that the reactant gases, as they pass though the respective dryers on their way to the fuel cell stacks retrieve the water previously removed.

Abstract: Method and apparatus for treating an edge region of a wafer. A toroidal shaped plasma cavity has an inner diameter which is slightly less than the diameter of the wafer being treated so that only the edge region of the wafer extends into the toroidal plasma cavity. An inert gas is flowed across a front and back side of the wafer into the plasma cavity. A reactive gas is flowed directly into the plasma cavity. The gases exit the plasma cavity without flowing over the surface of the wafer.

Abstract: An all permanent magnet Electron Cyclotron Resonance, large diameter (e.g., 40 cm) plasma source suitable for ion/plasma processing or electric propulsion, is capable of producing uniform ion current densities at its exit plane at very low power (e.g., below 200 W), and is electrodeless to avoid sputtering or contamination issues. Microwave input power is efficiently coupled with an ionizing gas without using a dielectric microwave window and without developing a throat plasma by providing a ferromagnetic cylindrical chamber wall with a conical end narrowing to an axial entrance hole for microwaves supplied on-axis from an open-ended waveguide. Permanent magnet rings are attached inside the wall with alternating polarities against the wall. An entrance magnet ring surrounding the entrance hole has a ferromagnetic pole piece that extends into the chamber from the entrance hole to a continuing second face that extends radially across an inner pole of the entrance magnet ring.

Abstract: A bra incorporating bra straps that are made from beads threaded onto an elongated tubular member in a decorative pattern. The straps include end connectors that allow them to be detachably secured to the bra. The straps may also include an adjustment member to allow the length of the straps to be lengthened or shortened.

Abstract: A volumetric displacement dispenser and method of using the dispenser is disclosed for dispensing liquid contents from an interior of a bottle with a bottle neck while preventing air from filling a void created within the interior of the bottle caused by the liquid contents being poured out of the bottle by gravity. The dispenser includes a stopper having first and second boreholes extending there through, the stopper being adapted to form an air-tight seal when it is seated into the bottle neck. An air pressure tube routed through the first of the boreholes has a first end open to atmospheric air and a second end open to the interior of the bottle. An expandable volumetric displacement balloon is attached to the second end of the air pressure tube and a one-way liquid valve is disposed in the outlet of the liquid flow channel in the stopper.

Abstract: A networked conferencing system is described wherein multiple moderation of conferences is accommodated by permitting a conference moderator to designate one ore more alternate conference moderators. Each alternate moderator has access to at least a subset of conference moderation functions, thereby permitting any alternate moderator to take at least partial control of conference proceedings in the absence of the “main” or “primary” moderator.

Abstract: A cap nitride stack which prevents etch penetration to the HDP nitride while maintaining the electromigration benefits of HDP nitride atop Cu. In one embodiment, the stack comprises a first layer of HDP nitride and a second layer of a Si—C—H compound disposed over the first layer. The Si—C—H compound is for example BLoK, or N-BLoK (Si—C—H—N), and is selected from a group of materials that has high selectivity during via RIE such that RIE chemistry from the next wiring level does not punch through. Carbon and nitrogen are the key elements. In another embodiment, the stack comprises a first layer of HDP nitride, followed by a second layer of UVN (a plasma nitride), and a third layer comprising HDP nitride disposed over the second layer.

Abstract: A high density plasma generated by microwave injection using a windowless electrodeless rectangular slotted antenna waveguide plasma source has been demonstrated. Plasma probe measurements indicate that the source could be applicable for low power ion thruster applications, ion implantation, and related applications. This slotted antenna plasma source invention operates on the principle of electron cyclotron resonance (ECR). It employs no window and it is completely electrodeless and therefore its operation lifetime is long, being limited only by either the microwave generator itself or charged particle extraction grids if used. The high density plasma source can also be used to extract an electron beam that can be used as a plasma cathode neutralizer for ion source beam neutralization applications.

Abstract: An amusement device in the form of a balancing tube game is described. In typical use, the balancing tube is balanced in a vertical orientation on a user's palm, finger, head, elbow, foot or wherever they wish to balance it. The balancing tube game comprises an elongated cylindrical tube with built-in tilt-sensing electronics and audible, visual and tactile feedback. The tilt-sensing electronics are adapted to sense whenever the tube tilts off-vertical by more than a predetermined critical angle. The built-in electronics comprise a microprocessor, tilt sensor, lights, a noise-generating element, such as a speaker, and a vibrator. Optionally, a motion sensor can be added so that game can confirm that it is being manipulated (rather than simply fixed in a vertical orientation). While playing the game, the user progresses through a predetermined series of game levels, each level being characterized by a specific set of lights, sounds and/or vibrations emanating from the game.

Abstract: Custom connections between pairs of copper wires in a last damascene wiring level are effected by creating openings in an overlying insulating layer which span a distance between portions of the two wires, then filling the openings with aluminum. The openings can be created (or completed) by a second, maskless UV laser exposure of positive photoresist which is used for patterning the insulating layer. If an opening is not created, an aluminum connecting shape overlying the insulating layer will not effect a connection between the two wires. Similar results can be achieved by laser exposure of a resist used to pattern the aluminum layer, thereby causing breaks in connecting shape when it is desired not to have a connection.

Abstract: Novel interconnect structures possessing a dense OSG material for 90 nm and beyond BEOL technologies in which a low power density oxygen-based de-fluorination plasma process is utilized to increase NBLoK selectivity are presented. These BEOL interconnect structures are capable of delivering enhanced reliability and performance due to the reduced risk of Cu exposure and hence electromigration and stress migration related failures. The oxygen based de-fluorination process is such that the plasma conditions employed {low power density (<0.3 Wcm?2); relatively high pressure (>100 mT); negligible ion current to wafer surface (applied source frequency only)} facilitate a physical expulsion of residual fluorine present on the chamber walls, wafer surface, and within the via structure; thus, minimizing the extent of NBLoK etching that can occur subsequent to removing polymeric byproducts of via etching.

Abstract: A pneumatic radial ply tire incorporating a crown reinforcing structure comprises at least one reinforcing hoop located approximately on the equatorial plane and disposed radially inward of the tread and radially outward of the carcass structure. The hoop is surrounded or encased by a layer of elastomeric transition material providing a flexible structural connection between the hoop and the adjacent carcass structure and belt structure. The hoop may have a substantially lenticular shape, or a complex shape with two thickened sections or lobes connected by a thin waist-like section, or a shape and a location that is asymmetric with respect to the equatorial plane of the tire, and may be made by winding a thin strip of material such as UHMWPE in an elastomeric matrix. The hoop may replace the belt structure of the tire.

Abstract: A method of performing latch up check on an integrated circuit (IC) design that comprises rasterizing a conductor region shape and contact shapes and iteratively expanding the contact shapes within the conductor region shape using a cellular algorithm. Direction values for contact cells can be used to limit the number of neighboring cells which must be explored. In every fourth iteration of the expansion process, corner cells may not be expanded. Reachable areas outside of conductors can also be explored.

Abstract: A variable modulation index for a transponder (102, 200, 400) capable of measuring one or more parameters (e.g., temperature, pressure) in an object (e.g., a tire, (104)) and transmitting a data stream (FIGS. 3C, 4B) to an external reader/interrogator (106). The transponder typically operates in a passive mode, deriving its power (Vxx, Vcc, Vdd) from an RF interrogation signal received by an antenna system (210, 410, 710), but can also operate in a battery-powered active mode. The transponder includes memory (238, 438) for storing measurements, calibration data, programmable trim settings (436b), transponder ID and the like. Data stream transmission is preferably accomplished by PSK modulation (700) of the received RF signal, wherein the magnitude of modulation (index) is programmably varied in binary steps according to the programmed trim settings, and dynamically varied according to the level of input power in order to optimize the transmission.

Abstract: A chemical mechanical polishing (CMP) step is used to remove excess conductive material (e.g., Cu) overlying a low-k or ultralow-k interlevel dielectric layer (ILD) layer having trenches filled with conductive material, for a damascene interconnect structure. A reactive ion etch (RIE) or a Gas Cluster Ion Beam (GCIB) process is used to remove a portion of a liner which is atop a hard mask. A wet etch step is used to remove an oxide portion of the hard mask overlying the ILD, followed by a final touch-up Cu CMP (CMP) step which chops the protruding Cu patterns off and lands on the SiCOH hard mask. In this manner, processes used to remove excess conductive material substantially do not affect the portion of the hard mask overlying the interlevel dielectric layer.