Abstract: An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.
Type:
Grant
Filed:
November 9, 1992
Date of Patent:
October 11, 1994
Assignee:
Martin Marietta Energy Systems, Inc.
Inventors:
Raymond A. Zuhr, Tony E. Haynes, Andrzej Golanski