Abstract: An apparatus for baking resists on semiconductor wafers, which is capable of preventing cold air from entering the interior of the baking chamber while a baking process is carried out, by controlling the temperature of ambient air surrounding the baking chamber to equal the internal temperature of the baking chamber. This control is achieved by providing a hot air supply unit and nozzles. The hot air supply unit generates hot air heated to a desired temperature and supplies the generated hot air to the nozzles. The nozzles are connected to the hot air supply unit and arranged near the baking chamber. The nozzles inject the hot air onto the outer surface of the baking chamber. The nozzles may be arranged around the entrance of the baking chamber where a wafer to be baked is loaded. In this case, the nozzles inject heated air onto opposite surfaces of the wafer being loaded or unloaded. The baking apparatus may have a configuration including a cooling chamber, a feeding chamber and a baking chamber.