Abstract: A heat dissipating device for cooling an electrical component is disclosed that includes a heat sink base. A plurality of helicoid pins is fixed to the heat sink base and extends therefrom. In one preferred embodiment, the helicoid pins have a diameter of about 0.05 inches to 0.15 inches, about 25-35 turns per inch, and a thread depth of about 0.005 and 0.02 inches. The helicoid pins provide an uneven cooling surface and an increased cooling surface area that increase the heat dissipation capability of the heat dissipating device, when compared to straight pins having the same diameter.