Abstract: Methods and apparatus are provided for analyzing a complex system that includes a number of subsystems. Each subsystem comprises at least one sensor designed to generate sensor data. Sensor data from at least one of the sensors is processed to generate binary evidence of a sensed event, and complex evidence of a sensed event. The complex evidence has more sophisticated mathematical properties than the binary evidence. The complex evidence comprises one or more of: a condition indicator (CI), a health indicator (HI), and a prognostic indicator (PI). A system fault model (SFM) is provided that defines statistical relationships between binary evidence, complex evidence, and an underlying failure mode (FM) that is occurring in the complex system. The binary evidence and the complex evidence are processed to identify failure modes taking place within one or more of the subsystems.

Abstract: Through substrate vias for back-side electrical and thermal interconnections on very thin semiconductor wafers without loss of wafer mechanical strength during manufacturing are provided by: forming desired device regions with contacts on the front surface of an initially relatively thick wafer; etching via cavities partly through the wafer in the desired locations; filling the via cavities with a conductive material coupled to some device region contacts; mounting the wafer with its front side facing a support structure; thinning the wafer from the back side to expose internal ends of the conductive material filled vias; applying any desired back-side interconnect region coupled to the exposed ends of the filled vias; removing the support structure and separating the individual device or IC assemblies so as to be available for mounting on a further circuit board, tape or larger circuit.

Abstract: A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate. A microelectronic die having an integrated circuit formed therein is attached to the first opposing side and the first portion of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor.

Abstract: A method of providing data associated with reception of media content is presented. In the method, a communication device receives media content from a media content receiver via a communication network. The received media content is output to a user of the communication device. Data is then generated in the communication device which includes information identifying a channel selected by the user over which the media content receiver receives the media content. The data further includes information identifying a time period during which the communication device receives the media content. The data is transferred via the communication network to a communication node.

Abstract: A system and method of determining aircraft position on an aerodrome ground surface having a centerline disposed thereon is provided. A current image of the aerodrome ground surface is captured using a camera that has a known focal length and is disposed on a vehicle at a preset pitch angle. The current image includes the centerline, which extends to a vanishing point in the captured image. The slope and intercept of at least a portion of the centerline are computed. The vertical and horizontal positions of the vanishing point are computed. An estimate of the vehicle position on the ground surface is computed using the computed horizontal and vertical positions of the vanishing point, the known focal length, and the preset pitch angle.

Abstract: MOS structures that exhibit lower contact resistance and methods for fabricating such MOS structures are provided. In one method, a semiconductor substrate is provided and a gate stack is fabricated on the semiconductor substrate. With the gate stack serving as a mask, impurity dopants are implanted into a semiconductor material having a first surface and disposed proximate to the gate stack. A trench is etched into the semiconductor material such that the semiconductor material has a trench surface within the trench. Further, a metal silicide layer is formed on the first surface of the semiconductor material and on the trench surface. Also, a contact to at least a portion of the metal silicide layer on the first surface and at least a portion of the metal silicide layer on the trench surface is fabricated.

Abstract: A motor vehicle front end and a method for producing a motor vehicle front end are provided in accordance with embodiments of the invention. The motor vehicle front end has a front wall and the front wall girder, the front wall girder essentially being situated in the direction of a vehicle transverse axis. In addition, the motor vehicle front end has a first front wall girder, the first front wall girder being situated essentially in the direction of a vehicle vertical axis. The first front wall girder is supported on the front wall crossbeam in a first area of the front wall crossbeam.

Abstract: Systems and methods are provided for resolving domain name services (DNS) queries for address information about hosts on a network. The queries are posited from remote users across a satellite or other remote link to a network, and are monitored as they pass through a central node logically present between the remote link and the network. A list of statistically significant hosts on the network is maintained and transmitted from the central node to the plurality of remote users across the remote link. By providing the remote nodes with a current list of popular hosts and associated address information, subsequent domain name services queries placed for the statistically significant hosts may be resolved without communicating across the remote link.

Abstract: A fastening element includes, but is not limited to at least one first body, at least one second body, and at least one locking device. The first body and the second body in each case on one end include, but are not limited to a pressing element for pressing an insulation package against an object. The first body and the second body movably engage each other so that the pressing elements are located at opposite ends of the fastening element. The at least one relative position of the first body to the second body may be fixed by means of the locking device. In this way effective fastening of insulation packages to objects in an aircraft cabin may be ensured without all the insulation packages having to comprise openings for accommodating fastening pins.

Abstract: Methods for fabricating a balance ring for a vehicular electric machine are provided. In one embodiment, the method includes the steps of providing a first metal layer having a first planar surface, providing a second metal layer having a second planar surface, cladding the second planar surface to the first planar surface to form a composite structure, and removing a portion of the composite structure to form an annular ring.

Abstract: Methods, system and apparatus are provided for increasing voltage utilization in a five-phase vector controlled machine drive system that employs third harmonic current injection to increase torque and power output by a five-phase machine. To do so, a fundamental current angle of a fundamental current vector is optimized for each particular torque-speed of operating point of the five-phase machine.

Abstract: The invention relates to a light arrangement, comprising a motor vehicle light which can be operated in at least two operating modes, as well as further comprising a control mechanism for the motor vehicle light. The invention further relates to a method for operating a motor vehicle light and a motor vehicle.

Abstract: Butterfly valve plate sealing assemblies are provided that include a sealing ring and a retention spacer disposed at least partially within a sealing ring groove formed about a periphery of a butterfly valve plate. The sealing ring includes a first portion, a second portion configured substantially perpendicular to the first portion, and a substantially L-shaped cross-section. The sealing ring is positioned at least partially within a groove opening and a groove body defining the sealing ring groove. The retention spacer is positioned at least partially within the groove opening and adjacent the first portion of the sealing ring. The retention spacer is configured to limit expansion of the sealing ring when under the influence of a pressurized fluid flow. The second portion of the sealing ring may be configured to optimize stiffness for a desired sealing ring tension.

Abstract: A hydraulic actuator includes, but is not limited to a first outflow and a second inflow and outflow as well as a closure device for closing the second inflow and outflow in the direction of outflow. The first outflow an outflowing hydraulic fluid is subjected to flow resistance. When a switching position is reached, the second inflow and outflow is closed in the direction of outflow so that the hydraulic fluid has to be discharged through the first outflow while overcoming the flow resistance. This damps the movement of the hydraulic actuator in the region of an end position.

Abstract: Cascading phosphors are described herein that produce emissions when they are excited by incident radiation. The cascading phosphors can be applied to articles, and can be useful in authenticating the article. The cascading phosphors include a host and at least three active ions.

Abstract: Methods and systems are provided for monitoring an automotive electrical system including an inverter having at least one switch. First and second voltage commands corresponding to respective first and second components of a commanded voltage vector on a synchronous frame of reference coordinate system are received. A plurality of duty cycles for operating the at least one switch are calculated based on the first and second voltage commands. First and second actual voltages are calculated based on the plurality of duty cycles. The first and second actual voltages correspond to respective first and second components of an actual voltage vector on the synchronous frame of reference coordinate system. An indication of a fault is generated based on the difference between the first components of the commanded voltage vector and the actual voltage vector and the difference between the second components of the commanded voltage vector and the actual voltage vector.

Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.

Abstract: A bumper system for a motor vehicle includes, but is not limited to, a bumper cross member, which is fixed to a stiff frame of the motor vehicle, a pliable bumper shell, a compressible structure which is formed between an upper area of the shell and the cross member and one support section which supports the lower area of the shell, which, together with a crash box holding the cross member is anchored to the flange plates of the frame.

Abstract: Methods for fabricating semiconductor devices are provided. The methods include providing a semiconductor substrate having pFET and nFET regions, each having active areas and shallow trench isolation. A hardmask layer is formed overlying the semiconductor substrate. A photoresist layer is provided over the hardmask layer. The phoresist layer is patterned. An exposed portion of the hardmask layer is removed from one of the pFET region and nFET region with the patterned photoresist acting as an etch mask to define a masked region and an unmasked region. An epitaxial silicon layer is formed on the active area in the unmasked region. A protective oxide layer is formed overlying the epitaxial silicon layer. The hardmask layer is removed from the masked region with the protective oxide layer protecting the epitaxial silicon layer during such removal step. The protective oxide layer is removed from the epitaxial silicon layer.

Abstract: An electrostatic discharge (ESD) clamp (41, 51, 61, 71, 81, 91), coupled across input-output (I/O) (22) and common (GND) (23) terminals of a protected semiconductor SC device or IC (24), comprises, an ESD transistor (ESDT) (25) with source-drain (26, 27) coupled between the GND (23) and I/O (22), a first resistor (30) coupled between gate (28) and source (26) and a second resistor (30) coupled between ESDT body (29) and source (26). Paralleling the resistors (30, 32) are control transistors (35, 35?) with gates (38, 38?) coupled to one or more bias supplies Vb, Vb?. The main power rail (Vdd) of the device or IC (24) is a convenient source for Vb, Vb?. When the Vdd is off during shipment, handling, equipment assembly, etc., the ESD trigger voltage Vt1 is low, thereby providing maximum ESD protection when ESD risk is high. When Vdd is energized, Vt1 rises to a value large enough to avoid interference with normal circuit operation but still protect from ESD events.