Abstract: An electrostatic chuck for clamping a substrate during manufacture thereof. The chuck has an electrostatic plate and a support therefor. The electrostatic plate has a top surface, which contacts the substrate, and which has an inner coil portion and an outer coil portion for connection to a DC source for forming an electric field. Heat in the substrate is removed by the plate. The plate has a plurality of selectively placed chambers and passages for removing heat by gas circulation therethrough.