Patents Represented by Attorney, Agent or Law Firm IP Solutions
  • Wafer level method for probing micromechanical devices
    Patent number: 6593749
    Abstract: Pressurized fluid from a nozzle is applied against the movable member of a micromechanical device, in order to measure the mechanical properties of the device. The technique is non-destructive, non-invasive, can be applied at the wafer, row or die level, and at early or intermediate stages of fabrication.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: July 15, 2003
    Assignee: Innovative Micro Technology
    Inventors: John Stuart Foster, Patrick Edward Feierabend, Michael James Shillinger