Abstract: An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Abstract: A method for electroplating a film onto a substrate. Electrical power is supplied to the plating surface through electrical contact made to contact pads on the underside of the substrate. Contact to the contact pads is made within a liquid-tight region. The contact pads are connected to the plating surface through the substrate. Because the contact scheme is provided within a liquid-tight region on the underside of the substrate, the contacts do not erode or become plated, nor do they consume an area of the plating surface.

Abstract: A chip-under-chip module and a substrate for making the module. The module comprises a first larger chip, a second smaller chip attached to the underside of the first chip, a substrate having a top surface to which the first chip is mounted, a cavity into which the second chip fits when the first chip is mounted on the top surface, and an access channel connecting the cavity to the top surface. Underfill is disposed under the first chip between the first chip and the substrate, between the first and second chips, within the cavity, and within the access channel. A process for manufacture of such a module comprises the steps of forming the substrate having the cavity and access channel in the substrate, connecting the first chip to the substrate, and dispensing underfill through the access channel.