Abstract: A data processing system for the storage of persistent and non-persistent data in a queue, and a method for the storage of data which is required to survive a system failure (persistent data) and data which is not required to survive a system failure (non-persistent data) on a single queue, are disclosed. The method involves receiving persistent and non-persistent data to be stored in a queue, then marking the data in time sequence order, before storing the persistent data in a first set of data pages and the non-persistent data in a second set of data pages. Upon receiving a request for removal of data from the queue, both the first and second sets of pages are checked and the data is removed in time sequence order. A log is preferably created to enable recovery in the event of failure and restart of the queue. When receiving and removing persistent data to be stored in and to be removed from the queue, log entries are made of changes to the persistent data only.

Abstract: Apparatus and method for reading data pages in a transaction processing system without locking the pages are disclosed. The system maintains a Global.sub.-- Committed.sub.-- LSN identifying the oldest uncommitted transaction accessing any of the data, and Object.sub.-- Committed.sub.-- LSNs identifying the oldest uncommitted transactions accessing particular files, tables and indexes. Each data page includes a Page.sub.-- LSN identifying the last transaction to have updated the page. To read a page, a transaction first latches the pages, and compares the page's Page.sub.-- LSN with the Global.sub.-- Committed.sub.-- LSN, or with the page's respective Object.sub.-- Committed.sub.-- LSN. If the Page.sub.-- LSN is older than the Committed.sub.-- LSN with which it was compared, then the transaction reads the page without locking it, since there can be no uncommitted transaction in process which might have updated the page's data. However if the Page.sub.-- LSN is younger than the Committed.sub.

Abstract: A single point bonding tool for use in ultrasonically bonding a fine or ultrafine wire to another electrical conductor, has a thin film resistor integrally formed thereon. The thin film resistor is integrally formed on the bonding tip by standard photolithographic techniques applied to the bonding tool. The tool combines ultrasonic energy and thermal energy provided by the resistor to provide required bonding energy that may be localized both in space and in time. The result offers optimized energy transfer to the selected workpieces and minimizes risk of damage to adjacent, heat sensitive devices.