Abstract: The disclosure relates to a method of joining nickel and nickel based alloys to columbium at low pressure and low temperature, wherein a thin titanium brazing foil is provided, with or without a copper coating electroplated thereon. The layers or foils of the metals to be joined are placed in intimate contact with opposite sides of the brazing foil under pressure and heated in a vacuum to a temperature above the eutectic of the metals being used and below 2000.degree. F. and preferably below 1950.degree. F. to provide the bond.

Abstract: The disclosure relates to a method of bonding columbium to columbium wherein a brazing foil of titanium which has been coated with either a layer of copper or a layer of nickel or layers of copper and then nickel, preferably on both sides of the foil, is disposed between the columbium sheets or the like to be joined. The columbium are placed in intimate contact with opposite sides of the foil and heated to a temperature above the eutectic point of the eutectics of the metals of the foil and no higher than about 1750.degree. F. for about 90 minutes and then cooled to provide the desired bond.