Abstract: A process for the preparation of 2,2-diorgano-3-arylpropionic acids is disclosed by the carbonylation of corresponding 2,2-diorgano-1-aryl ethanol in the presence of a Lewis acid catalyst. Furthermore, a process for the production of 2,2-diorgano-3-arylpropionic esters is disclosed by reacting a corresponding 2,2-diorgano-1-aryl ethanol with carbon monoxide and an alcohol in the presence of a Lewis acid catalyst.

Abstract: Arylalkylamines (as the hydrochloride salt), e.g. tyramine hydrochloride, are prepared by hydrogenating substituted or unsubstituted aryl-.alpha.-oximinoalkyl ketones, e.g. p-hydroxyisonitroacetophenone, in either in an aqueous reaction medium comprising hydrochloric acid, essentially without the presence of a lower alkyl alcohol in said reaction medium, or in an aqueous reaction medium comprising water, hydrochloric acid, and a lower alkyl alcohol, wherein the alcohol comprises less than about 90% by volume of the reaction medium. A substituent on the aryl portion of the aryl-.alpha.-oximinoalkyl ketone must be on a position which activates the aromatic ring.

Abstract: This invention relates to spiro-[(piperidine-, pyrrolidine-, or -hexahydroazepinyl substituted) pyrrolo[2,1-c][1,4]-benzoxazepines] having the following formula ##STR1## wherein R is hydrogen, lower alkyl, arylloweralkyl, acyl, lower alkenyl, lower alkynyl, and loweralkylbenzisoxazole; X is hydrogen, halogen, loweralkoxy, and trifluoromethyl; Y is hydrogen; 2' or 3' acyl, formyl, carbinol of the formula ##STR2## where R.sub.1 and R.sub.2 are the same or different and are independently hydrogen, loweralkyl, arylloweralkyl, aryl, loweralkenyl, lower alkynyl and lower alkylbenzisoxazole; loweralkyl, loweralkenyl and halogen; and n is an integer of 1 to 3. The compounds of this invention display utility as analgesic and antihypertensive agents.

Abstract: Divalent hapten derivatives wherein two hapten moieties are connected by means of a bifunctional spacer wherein the derivative has the formulaA--X--Awhere A is a bonded hapten moiety and X is a bifunctional spacer having the formula(B).sub.m --Y--(CH.sub.2).sub.n --Z--(CH.sub.2).sub.n --Y--(B).sub.mwhere m is independently 0 or 1, B is (CH.sub.2).sub.n', wherein n' is an integer from 1 to 4, or CO(CH.sub.2).sub.n", wherein n" is an integer from 2 to 4; Y is independently --CONH--, NHCO--, OOC--, --COO--, --O--, --S--, or --NR--, wherein R is hydrogen or alkyl; n is an integer from 1 to 10; and Z is an organic moiety containing at least one hydrophilic atom are disclosed.

Abstract: This invention relates to a support for oligonucleotide synthesis and more particularly to a necleoside-linker/polymer support composite having the general formulaP'--S'wherein P' is a polymer support which bears oxirane, aziridine or episulfide groups or which contains good leaving groups for nucleophilic displacement; and S' is a nucleoside-linker having the general formulaW--(CH.sub.2).sub.a --X--(CH.sub.2).sub.b --Y--(CH.sub.2).sub.c --Zwherein W and Z each independently comprise a nucleophile; X and Y which, independently may or may not be present, comprise groups of high hydrophilicity; and a, b, c are integers from 0 to 9, wherein a plus b plus c exceeds 6.

Abstract: A method of fabricating a printed circuit board is disclosed. The method comprises forming a metal substrate having a through-hole pattern. The metal substrate is coated with a dielectric powder having a suitable flow length value to form a dielectric coat on the substrate having a sufficient through-hole edge coverage. The dielectric coated substrate is then treated with a second powder to form a satisfactory topcoat thereon. Electrical circuitry is then formed on the topcoat in conjunction with the through hole pattern.

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively coating portions of the surface with a colloidophobic material to render the portions colloidophobic and to delineate an exposed surface pattern which is capable of retaining a colloidal species thereon. The selectively coated surface is treated with a sol comprising a colloidal species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal, and (2) a colloidal activating metal species capable of participating in an electroless metal deposition to deposit the colloidal species on the exposed surface pattern.

Abstract: A method for depositing a metal on a surface is disclosed. The method comprises coating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal dissolved in a solvent comprising water and an alcohol having a total number of carbon atoms ranging from 2 to 8. The coated surface is treated to reduce the metal salt to metallic nuclei to form a catalytic layer thereon capable of directly catalyzing the deposition of a metal on said nuclei from an electroless metal deposition solution.

Abstract: A method of depositing a metal on a dielectric surface is disclosed. The method comprises treating the surface with a stable hydrosol obtained by mixing and heating together in an acidic aqueous medium (1) a salt of a noble metal with (2) an organic compound containing at least two oxygen atoms selected from (a) an organic carbonate having a structural formula of ##STR1## where R = H, an alkyl radical, (b) ethylene glycol and (c) 1,3 dioxane. The treated surface is then exposed to a suitable electroless metal deposition solution to catalytically deposit an electroless metal deposit thereon.

Abstract: A method of selectively depositing a metal on a surface of a substrate is disclosed. A suitable substrate is selected and a surface is treated with a desensitizer selected from the group consisting of (a) hydrazine, (b) a substituted hydrazine having the structural formula ##STR1## where R.sub.1 is an organic radical selected from the group consisting of alkyl, cycloalkyl, aryl, alkaryl, aralkyl, alkoxy, aryloxy and heterocyclic radicals and R.sub.2, R.sub.3 and R.sub.4 are the hydrogen radical or are the same as R.sub.1, and (c) a mixture of the foregoing. The desensitizer-treated surface is selectively exposed to a source of ultraviolet radiation to render selected areas thereof incapable of desensitizing a sensitizing species. The radiation-exposed surface is treated with a sensitizing species to sensitize the selected areas.

Abstract: A cured epoxy polymer having improved adhesive properties is disclosed. The epoxy polymer is the reaction product of a mixture comprising a resin component comprising (a) a diglycidyl ether based upon linoleic dimer acid, (b) an elastomerically modified epoxy resin blend and (c) a diglycidyl ether of bisphenol A and/or bisphenol F and a suitable curing agent. The reaction mixture is heated at a suitable temperature for a period of time sufficient to attain a full cure of the epoxy.

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively treating the surface with a photopolymerizable composition, comprising an addition polymer containing a plurality of units of the formulae ##STR1## WHERE R and R.sub.1 are each a member taken from the group consisting of ##STR2## and pyrrolidone, R.sub.3 is an alkyl group of 1 to 18 carbons, R.sub.2 is a member selected from the group consisting of H and CH.sub.3 and x is a positive integer of 10 to 1000, to form a polymerized coating thereof on the surface to delineate an exposed surface pattern conforming to a desired metal pattern. The exposed surface pattern is capable of retaining a noble metal ion thereon. The treated surface is then exposed to a noble metal ion to selectively deposit the metal ion on the exposed pattern.

Abstract: A method of forming and growing a single crystal of a semiconductor compound comprising a Group II-VI or Group III-V compound is disclosed. The method comprises placing a single crystal seed of the semiconductor compound adjacent to a first reactant comprising a Group II or Group III element. A protective blanket, resulting from at least a second reactant of a Group VI or Group V element, is formed over the seed within a temperature zone to protect the seed from dissolution by the first reactant. The reactants are combined to form a melt at a first temperature within the temperature zone and to grow a single crystal from the melt on the seed at a second temperature within the temperature zone.

Abstract: A method for depositing a metal on a surface is disclosed. The method comprises coating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal to form a coated surface. The coated surface is exposed to a source of light radiation to form a catalytic layer capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The catalytic layer is treated with a fixing solution comprising an autocatalytic reducing agent for the non-noble metal ions of said reducible salt to at least stabilize the catalytic layer.

Abstract: A cured epoxy polymer having improved adhesive properties is disclosed. The epoxy polymer is the reaction product of a mixture comprising a resin component comprising (a) a diglycidyl ether based upon linoleic dimer acid, (b) an elastomerically modified epoxy resin blend and (c) a diglycidyl ether of bisphenol A and/or bisphenol F and a suitable curing agent. The reaction mixture is heated at a suitable temperature for a period of time sufficient to attain a full cure of the epoxy.

Abstract: A method is disclosed for selectively depositing a metal on a surface of a substrate capable of retaining thereon a colloidal activating metal for electroless metal deposition. The method comprises coating a portion of the surface with a copolymer of maleic anhydride and a vinyl monomer, wherein the copolymer coat is selectively incapable of retaining thereon the colloidal activating metal species, to delineate an uncoated surface pattern which is capable of retaining the colloidal activating metal species thereon. The selectively coated surface is treated with a sol comprising the colloidal activating metal species to deposit the metal species only on the uncoated surface pattern. Subsequently, the colloidal species deposited pattern may be exposed to an electroless metal deposition solution to deposit a metal thereon.

Abstract: A printing ink is disclosed. The ink comprises (a) a reactive resin combined with a second resin comprising a substantially anhydrous water-soluble thermosetting stable methylated urea-formaldehyde resin wherein the weight of the methoxyl substituents therein is between 28% and 40% of the weight of the resin and the molar ratio of the reacted formaldehyde in the resin to the methoxyl substituents is such that in the absence of organic solvent the resin at 25.degree. C. is soluble to the extent of at least 50% by weight in water and dissolves at least 50% of its weight of toluene, the polymeric form of the resin being not substantially in excess of tetrameric, the molar ratio of reacted urea to reacted formaldehyde in the resin and the molar ratio of reacted formaldehyde to reacted methanol therein being within the ranges:______________________________________ Molar ratio Ranges Urea :CH.sub.2 O :CH.sub.3 OH CH.sub.2 O :CH.sub.3 OH ______________________________________ Lower 1 2.2 1.3 1 1.10 Upper 1 2.8 2.

Abstract: A device for use in joining wires such as electrical conductors is disclosed. The device comprises a ferrule, the exterior surface of which is covered with a coat or layer comprising an explosive composition. The method of joining includes coaxially aligning the end portions of two wires within the ferrule and then detonating the explosive composition to produce a metallurgical bond between the ferrule and each wire end. Apparatus for forming the novel splice is also disclosed.

Abstract: An energy beam, such as the coherent output of a laser, is applied to a thin film in a controlled manner, preferably as a pluse. The length of the pulse is regulated to form a tapered aperture in the film. The duration, energy and wavelength of the beam pulse with respect to the thickness, thermal properties and optical properties of the film are such that impingement of the beam pulse on a first surface of the film results in controlled removal of a small amount of the film. The pulse is terminated before the temperature gradient between the first film surface and a second film surface (the film's thickness being bounded by the surfaces) is zero. Plural pulses may be serially applied to form the tapered aperture to a desired depth.Typically, the thin films range in thickness from several hundred angstroms (.about.400A.) to about 10,000A. and may be dielectrics (SiO.sub.2, Si.sub.3 N.sub.4, Ta.sub.2 O.sub.5), metals (Au, Al, Ta, etc.) and silicon.

Abstract: A method of etching a surface of a substrate comprising lithium tantalate (LiTaO.sub.3) and chemically similar materials is disclosed. The method includes contacting the surface with a mixture comprising hydrofluoric acid and sulfuric acid. In addition to its etching action, the mixture is also capable of polishing the thus treated surface.