Abstract: The modular wall includes a sheet pile wall 12 with support brackets 20 that provide cantilever support to a facade of interlocking rows of blocks 30-34. The support member 20 includes vertical members that extend from the top of the sheet piling part way down the length of the sheet piling. Base members 24 extend from the vertical members and are supported by angled braces 22. Horizontally extending key members rest on the base members and are affixed thereto. The key members provide a key for connecting to a slot of a first row of modular blocks. The modular blocks are stabilized by geogrid 28 that is captured in the key and slot interconnection of the modular blocks and is affixed to the sheet piling 12 or embedded in concrete fill.

Abstract: The present invention induces provides a gettering trench on the front surface of a device substrate. In one embodiment it induces stress and simultaneously forms a gettering zone 40 for gettering impurities in an integrated circuit structure. In another embodiment, the trench is filled with gettering material 72 such as polysilicon. The two gettering mechanisms may be combined 82,84. The invention is useful for providing gettering in bonded wafers and in silicon-on-insulator devices (FIGS. 4,5).