Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
Type:
Grant
Filed:
March 4, 2008
Date of Patent:
December 14, 2010
Inventors:
Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda