Abstract: A support assembly for a cooling pad evaporation system to be used in an opening within the wall of a building and having a water conductor provided with spaced openings in the top thereof, a cover for the water conductor which dissipates water completely over the top surface of the pad, a plurality of individually distinct cooling cells, and a gutter positioned below the pads. The cover is made up of two major structural pieces; one being the rear piece which is attached to the wall, and the other being a front piece with one end extending over and interlocking with a flange located on the top of the rear piece. Inside the cover is a top cover connector, which is an inverted "L"-shaped member providing a uniform surface for deflecting the upwardly directed water down onto the pads, water conductor support brackets and a water conductor.