Abstract: An emulated electrically erasable memory system includes a random access memory (RAM) and a non-volatile memory (NVM). A write access to the RAM is received which provides first write data and a first address, where the first write data is stored in the RAM at the first address, and a currently filling sector of the NVM is updated to store both the first write data and the first address as a first record. In response to the write access, based on whether there are any remaining active records in an oldest filled sector of the NVM, a portion of an erase process or a transfer of up to a predetermined number of active records from the oldest filled sector to the currently filling sector is performed. The predetermined number of active records is less than a maximum number of total records that may be stored within the oldest filled sector.

Abstract: A method of forming a semiconductor device includes forming a first dielectric layer over a semiconductor substrate, forming a plurality of discrete storage elements over the first dielectric layer, thermally oxidizing the plurality of discrete storage elements to form a second dielectrics over the plurality of discrete storage elements, and forming a gate electrode over the second dielectric layer, wherein a significant portion of the gate electrode is between pairs of the plurality of discrete storage elements. In one embodiment, portions of the gate electrode is in the spaces between the discrete storage elements and extends to more than half of the depth of the spaces.

Abstract: An N channel transistor and a P channel transistor have their source/drains contacts with different suicides to provide for low resistance contacts. The silicides are chosen to provide good matching of the work functions. The P-type source/drain contacts of the P channel transistors have a silicide that is close to the P work function of 5.2 electron volts, and the N-type source/drain contacts of the N channel transistors have a silicide that is close to the N work function of 4.1 electron volts. This provides for a lower resistance at the interface between these source/drain contact regions and the corresponding silicide. These suicides with differing work functions are achieved with implants as needed. For example, for N-type source/drain contacts and a base metal of cobalt, titanium, or nickel, the implanted material is platinum and/or iridium. For the P-type, the implanted material is erbium, yttrium, dysprosium, gadolinium, hafnium, or holmium.

Abstract: An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node (204a) for receiving an output current to be impedance matched; a second node (212, 214) for receiving output current from the first node; a first current conductor (202c) for carrying current from the first node to the second node; a third node (204b) for receiving output current from the second node; and a second current conductor (202d) for carrying current from said second node to said third node, whereby the first and second current conductors are closely positioned so that their inductance is the sum of their self-inductances and the negative sum of their mutual inductance.

Abstract: In a memory, a bias circuit (112, 212, 312, 412) uses a current reference (108) for providing a reference current and control circuitry (106, 120) to bias a sense amplifier (114) with a varying voltage (VB). The varying voltage maintains current through MRAM bit cells (177-179) at a value proportional to the reference current over variations in average bit cell resistance with immunity to variations in process, supply voltage and temperature. In one form, a mock sense amplifier (122, 126, 132, 134) and mock array of bit cells (130, 136) are used to establish internal steady state voltages equivalent to a steady state condition of the sense amplifier with equalized outputs and to generate the varying bias voltage. Matching diode-connected transistors in each of the control circuitry and either the mock sense amplifier or the sense amplifier is used to generate the varying bias voltage.

Abstract: A DRAM is operated based upon an external clock input, a column enable, and a row enable. The DRAM is accessed and row and column addresses are latched into buffers based upon the clock input.

Abstract: A process is disclosed for fabricating complementary insulated gate field effect transistors including doped field isolation regions and optional punch through protection. In one embodiment of invention, a silicon substrate is provided which has N-type and P-type surface regions. First and second masks are formed overlying active areas of the two surface regions. A third mask is then formed overlying the first region and the first mask. P-type impurities are implanted into the second region with an implant energy which is sufficient to penetrate through the second mask but insufficient to penetrate through the third mask. A second P-type implant is performed with an implant energy insufficient to penetrate through either mask. The first implant will aid in preventing punch through while the second implant dopes the field region. A fourth mask is then formed overlying the second region and the second mask.

Abstract: A read-only-memory circuit is disclosed which includes a plurality of column conductors and circuitry for selecting one of the plurality of column conductors in response to an input address. The selection circuitry couples each of the column conductors to a common node which is coupled to a precharge circuit such that only the selected column conductor is precharged. The precharged circuit includes first and second diode-connected IGFET devices coupled in series such that the first IGFET device is a standard enhancement mode transistor which includes an implanted channel while the second IGFET device is a natural transistor which does not include an implanted channel.