Abstract: The present invention provides a method of preparing a surface of a silicon wafer for formation of HSG structures. The method contemplates providing a wafer having at least one HSG template comprising polysilicon formed in BPSG, the HSG template being covered by silicon dioxide. The wafer is treated with a cleaning agent to clean the surface of the wafer. Next, the wafer is treated with a conditioning agent. The conditioning agent removes native oxide from the HSG template without excessively etching structural BPSG. Preferably, the conditioning agent also removes a thin layer of polysilicon on the HSG template. The wafer is then transferred to a process chamber for HSG formation.

Abstract: Medical devices that are configured for insertion into a body lumen, such as the male urethra, are provided with one or more inflatable balloons having elastic sleeves, wherein each elastic sleeve is adapted to inflate in response to inflation of a respective balloon, and to deflate in response to deflation of the respective balloon. When a balloon is in a deflated condition, a respective elastic sleeve exerts a circumferentially compressive force against the balloon to cause a smooth, reduced cross-sectional profile of the balloon along an axial extent thereof. This smooth, reduced cross-sectional profile can facilitate passage of the medical device through a body lumen during both insertion and extraction of the medical device. A thin layer of fluid may be disposed between a treatment balloon and a respective elastic sleeve to facilitate heat transfer from a treatment balloon to a surrounding elastic sleeve or to administer a therapeutic agent to localized tissue.

Abstract: Flexible treatment catheters are configured to be inserted into a body lumen or cavity to deliver heated fluid through at least one fluid lumen therein to thermally treat or ablate a targeted site in a biological subject. The flexible treatment catheters can include improved thermally insulated regions comprising a mixture formed of liquid elastomeric (such as a polyurethane) mixture (which transitions to a solid state) and miniaturized hollow plastic bodies positioned between the outer wall of the treatment catheter and the fluid lumen. The thermally insulated region is configured such that, measured ex vivo, the treatment catheter can present a maximum temperature of below about 45° C. on the external surface of the outer wall of the treatment catheter when the treatment catheter circulates fluid having an inlet temperature of above or between about 60°-62° C.

Abstract: A method of forming a conductive plug in a contact hole comprising: providing a wafer having a conductive layer comprising silicon adjacent a dielectric layer comprising silicon oxide, and a contact hole disposed in the dielectric layer, the contact hole having surfaces that include sidewalls formed in the dielectric layer and a bottom defined by the conductive layer, a contaminant material being disposed over at least a portion of the conductive layer defining the bottom of the contact hole, the dielectric layer having a surface in which the contact hole terminates in an opening opposing the bottom; depositing a layer of a barrier material on the work object, the layer having a substantially uniform thickness from the surface at the opening of the contact hole to the bottom of the contact hole; and depositing a layer of a protective material barrier around at least opening of the contact hole; etching the material at the bottom of the contact hole to expose the contaminant material while retaining protective

Abstract: A prostatic stent is configured as a unitary body, which is adapted to reside above the sphincter when in position in a subject and allow normal functioning of the sphincter. The stent includes and elongated and substantially narrow conduit, which extends through the sphincter and outside the body of the subject. The conduit is sized and constructed to allow normal operation of the sphincter. The stent also includes and upper and/or an intermediate inflatable portions and may include a second conduit for the introduction of medication to the stent.

Abstract: A sheath assembly for a medical instrument such as an endoscope comprises an outer sheath and inner sheath and novel means for providing out-flow of fluids from a surgical site. The outer sheath is disposed about at least a portion of an inner sheath. The assembly has an outflow aperture disposed in an outer wall at the distal end of the assembly. The outflow aperture is the initiation for an outflow conduit that is generally longitudinally disposed in a distal tip portion of the assembly and communicates fluid to a main outflow channel formed between the outer sheath and inner sheath. In a preferred embodiment, the outflow aperture and conduit are disposed wholly or partially in a dielectric tip element. The novel assembly allows improved outflow by disposing the outflow aperture at a more distal end of the instrument than conventional devices such that the outflow aperture is less prone to blockage by surrounding tissue or debris when used in tight anatomical passages.

Abstract: Methods of treating the prostate include administering a thermal ablation therapy and inhibiting the obstruction or closure of the prostatic urethral opening by forming a biodegradable stent in situ in the subject such that the stent attaches to the walls of the prostatic urethra. A related method of treating BPH includes thermally treating or ablating localized tissue in the prostate with a treatment catheter and inserting flowable stent material via the treatment catheter into the prostate (either before, during, or after the thermal treatment), forming the flowable stent material so that it defines a stent that remains in position after removal of the treatment catheter to inhibit the closure of the urinary passage. Associated stents and catheters are included.

Abstract: The present invention provides a tire assembly for irrigation systems that prevents the formation of ruts caused by repeated travel along a path by tires of a mobile vehicle or structure. The tire assembly includes dual tires with a flexible belt member wrapped around the outer periphery of the two tires having a plurality of cleat members located on the outer surface of the flexible belt member. The cleat members direct water away from the center of the travel path. The flexible belt member further includes plural center guides to keep the belt in place. The tire assembly reduces soil compaction by providing a greater ground engaging surface area to more evenly distribute the weight of the equipment and by directing water away from the center of the travel path.

Abstract: The present invention provides a packaged chip that includes at least one dam disposed between the chip and interposer, blocking an encapsulant flow path in the package formed by the assembly of the interposer and chip. In one preferred embodiment, the dam comprises a lead-like structure formed on the interposer that closes an encapsulant flow path in the package. The invention further provides a novel interposer that may be assembled with a chip into the novel packaged chip. Methods are also provided for making the packaged chip and the interposer.

Abstract: The present invention provides a packaged chip that includes at least one dam disposed between the chip and interposer, blocking an encapsulant flow path in the package formed by the assembly of the interposer and chip. In one preferred embodiment, the dam comprises a lead-like structure formed on the interposer that closes an encapsulant flow path in the package. The invention further provides a novel interposer that may be assembled with a chip into the novel packaged chip. Methods are also provided for making the packaged chip and the interposer.

Abstract: The present invention provides a method of preparing a surface of a silicon wafer for formation of HSG structures. The method contemplates providing a wafer having at least one HSG template comprising polysilicon formed in BPSG, the HSG template being covered by silicon dioxide. The wafer is treated with a cleaning agent to clean the surface of the wafer. Next, the wafer is treated with a conditioning agent. The conditioning agent removes native oxide from the HSG template without excessively etching structural BPSG. Preferably, the conditioning agent also removes a thin layer of polysilicon on the HSG template. The wafer is then transferred to a process chamber for HSG formation.