Abstract: A sensing device includes an RFID chip and a differential variable reluctance transducer (DVRT) sensor that can be read remotely with electromagnetic power provided to the device from a remote reader. The ac signal provided to the device by inductance is used for powering the RFID chip and exciting the sensor. Data read from the sensor can also be transmitted back to the reader using the power provided by the reader. The sensor circuit uses a lower amount of current than the RFID chip, so it does not contribute appreciably to device power requirements.

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

Abstract: The novel peak strain detection linear displacement sensor system for smart structures is designed to provide monitoring of the strain in structures and reporting their strain histories. The system comprises the use of micro miniature, high resolution, passive peak strain detector. A displacement sensor, such as a differential variable reluctance transducer, is used and the sliding core of the unit is constrained so that it shows the maximum movement in one direction. Once positioned and attached, mechanical movement of the core will always occur in response to structural deformation. The system comprises attachment devices and a body clamp and core extender and compressor, a housing, a spring loaded collar, a sensor core and a measuring unit.

Abstract: A dual shoulder guitar strap, has two straps. Each goes over one shoulder. The strap has length adjustment buckles for each of these straps. The strap also has a device for adjusting position of each strap on its shoulder. Length adjustments and position on shoulder adjustments are independently controllable. One strap can lie flat on the other so the strap can be used either to hold the guitar over one shoulder or to hold the guitar supported by both shoulders.

Abstract: The operating lifetime of a hot cathode discharge ion source is extended by introducing nitrogen into an ion implantation apparatus after introduction of an ion implantation gas, such as GeF4, is stopped. The nitrogen is preferably introduced along with the GeF4 during implantation as well.

Abstract: The present invention is directed to a candle packaging system that is comprised of a three part assembly. The first part is a clear box having a slightly frosted appearance. The candle packaging apparatus has a separate internal top and bottom cap units that are designed to be placed on top of and at the base of the candle in order to protect the top and bottom edges of the candle. The top and bottom caps are also constructed of a clear, frosted material. The third part of the construction is a printed insert that is designed to highlight the purpose and design of the candle itself. The box is designed to provide ease of access to allow the prospective buyer to smell the aroma of the candle and, at the same time, provide protection and keep the candle clean and fresh. A method of producing the candle packaging system is also disclosed.

Abstract: A multidrop network of multichannel, addressable sensing modules (ASM's), to be embedded within a composite structure, remotely powered, and interrogated by a personal computer through a non-contacting inductive link. Each ASM contains a microprocessor with non-volatile memory, multiplexer, programmable gain and filter instrumentation amplifier, and sigma delta analog to digital converter (all housed in two thin surface mount packages). An embedded mothernode includes circuitry for power and data reception (into the structure), and data transmission (back out of the structure). The external interrogation system communicates into the network of ASM's by modulating the AC waveform that delivers power to the embedded electronics. Once addressed, each ASM powers up its programmable (gain & filter) sensing channels (3 full differential or 5 pseudo differential) and data conversion elements.

Abstract: A socket for testing or burning-in electronic components has a cover including a heat sink and a sensor. The heat sink and sensor are spring loaded so they make direct, temporary contact to an electronic component in the socket during burn-in. A heat transferring device is coupled to each heat sink. The heat transferring device uses input from the sensor to provide heat or cooling to each heat sink to individually control the temperature of each component. The heat transferring device can be an electric heater or a cooling device, such as a fan. Both can also be used. A plurality of these sockets are used in a forced air convective oven for burning-in a plurality of electronic components at one time. The oven provides oven heating and cooling for all components while the socket heater and sensor provide individual temperature control for each component.

Abstract: The novel sensor assembly is comprised of a threaded housing with pressure relief tracks through the threads that terminate at a hole through the housing and a displacement sensor. In the preferred embodiment, we have included an integral connector, a super-elastic core carrier and a Differential Variable Reluctance Transducer. Other sensor types could be used to construct a pressure equalized displacement sensor as described herein, these may include: capacitive, resistive, Hall effect, eddy current, and differential variable transformer. The sensor is attached to a keyed connector and the entire assembly is potted into the housing. A temperature probe can also be potted with this assembly to allow for multiple tasks t1o be performed by this one housing. The housing is threaded on one end to allow for easy mounting. A hole is drilled through the housing just in back of the sensor and two tracks run perpendicular to and slightly deeper than the threads. The tracks connect to the through hole.

Abstract: Different symmetrical and asymmetrical devices are formed on the same chip using non-critical block masks and angled implants. A barrier is selectively formed adjacent one side of a structure and this barrier blocks dopant implanted at an angle toward the structure. Other structures have no barrier or have two barriers. Source and drain engineering can be performed for LDD, halo, and other desired implants.

Abstract: A hub for a pulley, gear, or wheel is formed with an integral key or other integral means for preventing relative rotation and with an integral stop for positioning the hub axially on a shaft. The hub has a generally cylindrical opening for a shaft, an integral key extending inwardly into the shaft opening along at least part of the shaft opening for engaging a keyway in the shaft, and an integral mechanical stop covering at least a portion of one end of the shaft opening. The integral key preferably extends the entire length of the shaft opening. The mechanical stop preferably has an opening which is disposed at least around one end of the integral key. The mechanical stop serves to position the pulley, gear, or wheel precisely with respect to the end of a shaft when the pulley, gear, or wheel is assembled onto the shaft. The keyed hub is manufactured by powder metallurgy. One or more body plates are welded to the formed hub to form a pulley, gear, or wheel, or the hub is pressed into a body plate.

Abstract: A short pulse of radiation is generated by shining radiation through a magneto-optical material. The material is excited twice to rapidly change a property of the wave, such as the direction of the polarization. The first excitation rotates the polarization in a first direction and the second excitation brings the polarization back to its initial direction before the first excitation. Although the time for relaxation from the excitations may be lengthy, a pulse of light can be produced that is shorter in time than the time for excitation plus the time for relaxation. Light experiencing the pair of lengthy relaxations has each cancelling the effect of the other. The pulse of light has a length that depends on the time difference between the two excitations and the spacing between them. The rapid excitations are provided by pulses of current in a superconductor located near the magneto-optical material.

Abstract: An evaporation system has fluorocarbon polymer-coated surfaces to permit easy removal of deposited metal. Evaporated lead-tin films will adhere strongly enough to a Teflon-coated shield so that the lead tin does not fall off during vacuum deposition but the bond between the lead-tin and the Teflon is still weak enough so that the lead-tin coating is easily peeled off, leaving the Teflon coating on the shield intact. The peeled lead-tin is substantially free of contamination so it can be reused, for example, in a subsequent deposition.

Abstract: A sensing device includes a Wheatstone bridge and a source of a stimulation configured to apply the stimulation across two electrodes of the Wheatstone bridge. The device also includes a timing sensitive circuit configured to detect timing of a signal appearing across one of the other electrodes of the bridge as a result of the stimulation being applied. The timing provides a way to read the sensor. The device can be powered remotely and data so read can be transmitted using the remote power. The timing sensitive circuit includes a comparator. The comparator provides a high logic signal for a time related to the reactance of one leg of the Wheatstone bridge, and that provides a reading of a differential sensor having elements in each leg of the bridge.

Abstract: A semiconductor chip with uniform topology includes a memory cell having a stacked capacitor self-aligned with a bitline. Thick insulation on the bitline and on interconnect wiring on supports circuits of the chip serves to provide the uniform topology and to provide for the self-alignment of the capacitor and bitline. Bitlines and support circuit interconnect wiring are both formed from the same level of metal but they are patterned in separate masking steps. The stacked capacitors are separated from each other by less than the minimum dimension of the photolithographic system used for fabrication.

Abstract: A semiconductor chip includes a semiconductor substrate having a rectifying contact diffusion and a non-rectifying contact diffusion. A halo diffusion is adjacent the rectifying contact diffusion and no halo diffusion is adjacent the non-rectifying contact diffusion. The rectifying contact diffusion can be a source/drain diffusion of an FET to improve resistance to punch-through. The non-rectifying contact diffusion may be an FET body contact, a lateral diode contact, or a resistor or capacitor contact. Avoiding a halo for non-rectifying contacts reduces series resistance and improves device characteristics. In another embodiment on a chip having devices with halos adjacent diffusions, no halo diffusion is adjacent a rectifying contact diffusion of a lateral diode, significantly improving ideality of the diode and increasing breakdown voltage.

Abstract: A substrate, such as a semiconductor chip or wafer, is implanted along with product wafers in an ion implant vacuum system. The substrate is then annealed in an annealing step that is accomplished while the substrate is within the vacuum system. The annealer is a rapid thermal annealer, such as a laser annealer or a flash lamp annealer. The annealing step does not affect the product wafers. Then a measurement is performed on the implanted and annealed substrate while it is within the vacuum system that can be suitably correlated with implant dose. The measurement can be with a technique such as a four point probe or with a tool that measures optical reflectivity from a surface of the implanted substrate. An additional implant can then be provided to product wafers if necessary to come closer to the desired dose.

Abstract: Fine feature lithography is enhanced by selectively providing exposures to correct for effects such as foreshortening, corner rounding, nested to isolated print bias, feature size dependent bias, and other image biases in semiconductor processing. These results are achieved by increasing the local exposure dose in critical areas of specific images, such as line ends and corners. The general process incorporates techniques which tailor the exposure dose as a function of position to achieve the desired final image shape. The techniques include contrast enhancement layers (CEL), scanning optical beams, and exposures with different masks. In one embodiment the process of forming a pattern comprises the steps of providing a substrate having a photosensitive coating, exposing the center area of the pattern on the photosensitive coating with one mask, and exposing ends of the pattern on the photosensitive coating without exposing the center area with a second mask.

Abstract: The present invention provides an ozone processing monitor and a method of using the same in ozone processing to determine whether sufficient ozone treatment has occurred on a production part needing ozone treatment. The ozone processing monitor of the present invention comprises an ozone sensitive material which is capable of thinning, bleaching, forming an oxide layer or undergoing any other physical or chemical change upon exposure to ozone, wherein said physical or chemical change produces a visible color change of said ozone sensitive material which can be monitored during or following ozone processing. The color change of the ozone sensitive material can be compared to standards to determine if too little, too much or appropriate ozone treatment has occurred.