Abstract: A method of variably exposing photosensitive material. A semiconductor wafer is provided. A first target region and a second target region are identified on the semiconductor wafer. Photosensitive material is provided on the semiconductor wafer. An illuminating system including a source of illumination is provided. A mask is provided between the source of illumination and the photosensitive material. The photosensitive material is illuminated through the mask with the illuminating system to provide in a single step of the illuminating system a first illumination dose to the first target region and a second illumination dose to the second target region. The first illumination dose differs from the second illumination dose. No further illumination dose is provided to equalize the first illumination dose and the second illumination dose.

Abstract: A wafer lift assembly including an RF shunt is provided. An insulating rim is connected to a powered lift cylinder via a conductive screw. The head of the screw is recessed below a top surface of the rim. A cover is arranged over top of the rim and screw. The RF shunt is a layer of conductive material arranged between the rim and the cover.

Abstract: An apparatus used for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in proper alignment consists of a holding fixture, which includes upper and lower pocket receptacles for receiving the semiconductor devices. The semiconductor devices are placed into the respective upper and lower slots aligned to two or more edges of the holding fixture.

Abstract: Formation of a contact probe having a pattern of dendritic textured contacts complementary to that of a contact pad array on a bare chip allows formation of simultaneous temporary connections to all contact pads of the bare chip at a much reduced compressional force across the chip. The reliability of such connections at such a reduced force allows screening, burn-in and full functional testing of the bare chip at a high throughput by an automated apparatus to exploit potential economies of "known good die" (KGD) processing for limiting or avoiding repair, rework and further processing of less than fully functional chips for complex electronic packages. The compressional force is sensed by a pressure sensor, the output of which controls the advancement of the bare chip toward the contact probe such that the dendritic textured contacts of the contact probe penetrate the contact pads of the bare chip.