Patents Represented by Attorney James M. Lee

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  • Integrated heatsink and heatpipe
    Patent number: 6163073
    Abstract: A heatsink mounted to an electronic device having an area substantially greater than that of the device includes a heatpipe in the heatsink for transferring heat within the heatsink to reduce thermal gradients therein.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: December 19, 2000
    Assignee: International Business Machines Corporation
    Inventor: Janak G. Patel