Abstract: An improved latch capable of operation in an edge-triggered, data-handling mode and in an LSSD clocked mode. The latch generally comprises a polarity hold latch L1 connected to a polarity hold latch L2. The -C clock input of the latch is tied to the +B clock via an OR invert gate. Thus, during the loading of the L1 latch and data transferred to the L2 latch, the loading and transfer of false data is eliminated, while the latch otherwise conforms to LSSD rules and can be tested accordingly.

Abstract: A method and associated system for monitoring errors that occur in magnetic media storage read and write operations, for identifying uncorrectable errors and classifying them. In the system, a counter keeps track of specific locations of data blocks as well as the physical locations of the data recorded upon the media. When an error occurs in read or write operations that cannot be corrected by the error correction circuits, the error location is stored. After an error correction procedure, including usual retry operations, is completed, the count values of the error correction procedures are also stored. Means are provided for comparing the recorded error counts for initial and retry operations. A match of error positions, not correctable through standard error recovery procedures and in the presence of valid recording channel electronics operation, indicates a media defect at the identified location.

Abstract: In a tape winding machine, a vacuum probe assembly for attaching one end of a section of tape to an adhesive patch oriented on the periphery of a reel mounted within a cartridge, and means for winding the tape on the reel, severing the tape an reattaching the trailing end to the vacuum probe for subsequent adherence to the reel of the next cartridge.

Abstract: An automatic amplitude equalizer for magnetic recording channels which utilizes a readback training sequence, monitors the total power lost during the training sequence due to channel variations, and automatically adjusts the channel signal in response to the power loss factor.

Abstract: Winding apparatus for continuously winding tape media upon reels contained within closed cartridges. The winding apparatus includes means for supplying cartridges alternatively to three separate in-line winding channels all of which perform a winding function and then collecting the wound cartridges off the individual lines and presenting an output station for a subsequent packing operation. Each channel includes vacuum extension means for reaching through an opening in each cartridge to apply an adhesive patch to the hub of the reel contained within the cartridge. Each line also includes means for continuously supplying tape media to a wind station for winding upon the reels passing through that line. At the wind station, additional vacuum means bring the leading edge of the media into the cartridge and press it against the adhesive patch, thereby attaching the media to the reel.

Abstract: A clocking system is disclosed for a multichannel data transmission system which includes a temporary storage medium, such as magnetic tape. The system is an improvement over prior art systems which utilize a separate phase locked loop clock correction circuit for each channel. The described system utilizes a single clock for the multiple channels which operates at a frequency F that is an integral multiple of the channel baud rate. Means are provided to continually monitor the phase error of each channel and a composite correction signal is derived and applied to the clock signal which is proportional to the average of the phase errors of the individual channels.

Abstract: A parallel to serial converter is described for recording channel applications, wherein a coded symbol comprising a plural number of bits is to be rotated or converted to a serial stream. The converter includes a variable delay section which accepts the parallel code inputs on a plurality of lines and delays each input bit a predetermined number of counts, depending upon which line it is input on. The delay unit supplies a selector array of gates with bit signals, and the selector array reorders the bits into the desired serial stream. An output register is provided to reclock the serial stream prior to further channel processing.

Abstract: A method and apparatus for applying a viscous fluid to a moving substrate is disclosed. The invention includes providing a die assembly from a pair of plates which are separated by shim means to define a fluid passage. The fluid passage communicates with a fluid reservoir having an opening bounded by smooth surfaces for contacting the substrate. The supply of ink is metered to the passage. The substrate is moved in contact with the smooth surfaces and the fluid is applied thereto by the reservoir. The trailing or downstream edge of the smooth surface is formed with an acute angle. Other features are also disclosed.

Abstract: An optical system and technique for monitoring a monotonic change in the thickness of a transparent film by means of optical interference, and for eliminating ambiguity in the identification of absolute film thickness. The system is particularly adapted for monitoring the etching of a dielectric film of uncertain initial thickness in microelectronic fabrication. The technique utilizes a white light source directed upon the film. Reflected light, modified by optical interference in the dielectric film, is monitored by photodetectors at two distinct wavelengths. The cyclic patterns of intensity change at the two wavelengths are compared to identify unambiguously the absolute thickness of the film, although the initial uncertainty in film thickness may have corresponded to several cycles of either wavelength pattern alone.

Abstract: A high speed current switch logic circuit wherein a first and a second transistor are operated in a current switching mode and wherein a third and a fourth transistor are provided whereby the current switching operation of the first and second transistor causes current switching operation of the third and fourth transistors and push pull switching of power to a load.

Abstract: An improved interferometer system for detecting the etch rate of an opaque material, such as silicon or metal. The system includes means for producing two parallel beams of light, with one beam being directed to the surface of the opaque material, and the other beam being directed to the surface of an adjacent masking material of transparent nature. The rate of etch of the opaque material is detected from the interference pattern changes between the first beam and the second beam. The system utilizes a novel arrangement of beam splitters which results in equal path lengths for the respective beams and further includes a viewing light which is passed by a system of dichroic filters to enable observation of the focus spot.

Abstract: In electron beam apparatus having a souce of electrons and a target area toward which the electrons are directed, electron beam forming means are provided along the path from the source to the target. These forming means include a first beam shaping member having a first spot shaping aperture therein, a second beam shaping member having a second spot shaping aperture therein, and means focusing the image of the first aperture in the plane of the second aperture to thereby form a composite spot shape defined by the image of the first aperture and the second aperture. Further means are provided for focusing the image of the composite spot in the target area.Preferably, the apertures are square shaped. Thus, by varying the position of the superimposed image of the first aperture with respect to the second aperture, a wide variety of rectangular shaped composite spots with different dimensions is obtainable. This permits the exposure of rectilinear patterns, e.g.

Abstract: A sputtering system adapted for depositing quartz in uniform thicknesses upon multiple wafers processed in batches including an anode plate having a plurality of wafer locations spaced from the center of the anode, with each wafer location comprising a wafer receiving recess in the anode plate having an angular bottom slope which, in effect, tilts the wafer to an optimum deposition angle with respect to the cathode, depending upon wafer spacing from the center of the anode, to insure uniform deposition across the wafer.

Abstract: An electron beam system useful in microfabrication of large scale integrated circuit patterns, particularly those of repetitive nature. The electron beam system includes beam shaping and aperture means disposed between an electron beam source and a target area which permit formation and projection of preselected entire characters or portions thereof into the target area for writing upon a wafer at that location. The pattern cells of such characters may contain as many as 1600 image points which are addressed and projected in parallel, thereby greatly reducing the handling requirements for pattern data as opposed to the techniques utilized in prior art scanning electron beam systems. The system further includes means for correcting for spherical aberration arising in the projection of images comprising a large number of parallel image points.

Abstract: A method and apparatus permitting accurate and repeatable steps of location and alignment of flimsy sheets during their transfer. A preferred embodiment comprises a sheet handler and method for aligning unfired ceramic green sheets used in multi-layer ceramic semiconductor packages. The thin flexible sheets are square or rectangular in shape and are provided with holes accurately punched in each corner thereof for alignment purposes. The sheets are moved by a vacuum input transfer head into orientation with a porous registration surface of an alignment fixture. The sheet is then trapped between opposed pressure zones emanating from the input transfer head and through the porous registration surface, respectively. With the sheet stabilized between the pressure zones four bullet-nosed alignment pins are raised from the registration surface into contact with the holes in the corners of the green sheet, thereby accurately aligning the sheet with respect to the alignment fixture.

Abstract: A vacuum pick up and transfer head adapted for handling flimsy sheets of material such as spacer sheet and uncured ceramic sheet commonly referred to as green sheet. The vacuum transfer head is of generally rectangular configuration having a sheet contacting lip having vacuum slots formed through the periphery thereof to hold the sheets in place by vacuum pressure. The center of the sheet contacting face is recessed whereby, with a sheet in place and acting as a diaphragm, a central vacuum chamber is also defined. A series of check valves are provided to control application of vacuum and positive pressure to the green sheet for picking the sheet up, retaining it and stripping it. A plurality of probes are provided in the handling head, adapted to selectively project through the sheet contacting surface for detecting green sheet and/or spacer sheet utilized inbetween layers of green sheet.

Abstract: A method of exposure of a target object by means of corpuscular beam shadow printing through a mask with several complementary zones wherein the beam, shiftable and tiltable about a point in the mask plane and arranged in parallel at a small distance from the target object, is first impinged upon a first of the complementary zones, then the object is shifted under a second of the complementary zones, and the positioning of the beam is changed so that any deviation of the actual position of the second area of the target object to be exposed from its nominal position is determined and compensated for by tilting the beam about a point substantially in the mask plane.

Abstract: A method and apparatus is described for performing automatic overlay measurements on wafers utilized in semiconductor manufacturing. The overlay measurements are made at selected sites on a given wafer where a single bar pattern has been overlaid over a double bar pattern. The position of the single bar center line with respect to the center line between the double bars is a direct indication of the overlay error of the two patterns. The overlay error is measured in both the X and Y dimensions and is utilized to monitor the overlay error or to produce statistics and correlations to system parameters so that the sources of overlay errors may be identified and the errors eliminated or minimized on subsequent wafers being processed.

Abstract: In an apparatus for bombarding a target with a beam of ions, an expedient is provided for maintaining the beam line and target under vacuum of 2.times.10.sup.-4 Torr. or lower pressures. The apparatus includes a mass separator, e.g., analyzing magnet adapted to provide selected ions which are to be formed into the desired beam with a trajectory along a selected axis: the target is positioned along this selected axis; the apparatus further includes: a housing extending from the mass separator to the target to enclose the axis and target within a chamber, beam defining means within said chamber traversing said axis and impeding the flow of gas through said chamber, said defining means having a beam defining opening therein at said axis to permit the passage of a selected portion of the beam toward the target, and vacuum drawing means connected to said chamber through an opening in said housing crossing said beam defining means whereby said drawing means removes gas from both sides of said beam defining means.

Abstract: An aluminum-transition metal Schottky barrier contact, and methods of fabrication thereof are disclosed. In one preferred embodiment, the junction is comprised of an aluminum-tantalum intermetallic layer abutting a silicon substrate. Alternate embodiments utilize an intermetallic compound of a metal selected from the group of tantalum, zirconium, hafnium, niobium, titanium and nickel in combination with aluminum. The preferred embodiments can be fabricated by evaporation of a layer of a metal selected from the above mentioned group followed by evaporation of a layer of aluminum on a silicon substrate, after which an annealing step is utilized which creates the desired intermetallic compound in a layer abutting the silicon surface. Alternatively, the junction can be created by hot or cold sputtering of a preselected intermetallic compound of one of the metals with aluminum directly upon the silicon substrate, followed by deposition of a conductive layer such as aluminum.