Abstract: In a method of fabricating a battery, a substrate is annealed to reduce surface contaminants or even water of crystallization from the substrate. A series of battery component films are deposited on a substrate, including an adhesion film, electrode films, and an electrolyte film. An adhesion film is deposited on the substrate and regions of the adhesion film are exposed to oxygen. An overlying stack of cathode films is deposited in successive deposition and annealing steps.

Abstract: A battery comprises a substrate comprising an electrolyte between a pair of conductors, at least one conductor having a non-contact surface. A cap is spaced apart from the non-contact surface of the conductor by a gap having a gap distance dg of from about 1 ?m to about 120 ?m. The gap allows the conductor to expand into the gap. The gap is further bounded by side faces about a surrounding perimeter that may be sealed with a seal. In one version, the ratio of the surface area of the non-contact surfaces on the conductor to the total surface area of the side faces is greater than about 10:1. A pliable dielectric can also be provided in the gap.

Abstract: A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.

Abstract: A lens assembly comprises a spacer plate having first and second surfaces, and an array of lens barrels that each comprise a lens opening extending inward from the first surface of the spacer plate and a sensor cavity extending inward from the second surface of the spacer plate. An alignment tool comprising an array of alignment holes or prongs is used to align the lens to the orifices of the lens openings.

Abstract: A multifunction module for an electron beam column comprises upper and lower electrodes, and a central ring electrode. The upper and lower electrodes have multipoles and are capable of deflecting, or correcting an aberration of, an electron beam passing through the electrodes. A voltage can be applied to the central ring electrode independently of the voltages applied to the upper and lower electrodes to focus the electron beam on a substrate.

Abstract: Apparatus for in-situ monitoring of a process in a semiconductor wafer processing system consists of a process chamber having a dome, an enclosure disposed above the chamber, a process monitoring assembly positioned proximate the dome, an opening in the dome, and a window covering the opening. A portion of the apparatus supports the process monitoring assembly to establish a line-of-sight propagation path of monitoring beams from above the dome, through the window to the substrate to facilitate etch depth measurement without encountering interference from high power energy sources proximate the chamber. A method of fabricating a process monitoring apparatus consists of the steps of boring an opening into a dome, positioning the process monitoring assembly in proximity to the dome so as to allow a line-of-sight propagation path of monitoring beams from the process monitoring assembly to a wafer, and covering the opening with a window.

Abstract: A substrate processing chamber component demonstrates reduced erosion in an energized gas. The component has a ceramic structure composed of aluminum oxide with a surface exposed to the energized gas in the chamber. The erosion of the surface by the energized gas is substantially reduced by erosion resistant properties of the ceramic structure, which arise from a ratio of the total area of the grains GSA to the total area of the grain boundary regions GBSA in the ceramic structure of from about 0.25 to about 2.5. Also, at least about 80% of the grains in the ceramic structure have a grain size in the range of from about 1 micron to about 20 microns. The ceramic structure also has a purity of at least about 99.8% by weight to further reduce erosion of the surface.