Patents Represented by Attorney, Agent or Law Firm Jane E. Cennaro
  • Dual cure B-stageable underfill for wafer level
    Patent number: 6833629
    Abstract: A silicon wafer has a B-stageable underfill material deposited on the active face of the wafer. The B-stageable underfill comprises a first composition with a lower curing temperature and a second composition with a higher curing temperature, characterized in that the first composition has been fully cured.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: December 21, 2004
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Bodan Ma, Sun Hee Hong, Quinn K. Tong