Abstract: A system and method for a magnetic resonance (MR) imaging system includes a coil form, at least one magnet positioned about the coil form and configured to generate a magnetic field, at least one gradient coil for manipulating the magnetic field generated by the at least one magnet by way of a gradient field, and a heat pipe thermally connected to the coil form and having a cryogen therein. The MR imaging system also includes a cryocooler connected to the heat pipe to cool the heat pipe and the cryogen, wherein the coil form is comprised of a thermally conductive material in which eddy currents are substantially reduced during operation of the at least one gradient coil. The present invention has been described in terms of the preferred embodiment, and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims.

Abstract: An inductive and capacitive components integration structure includes a magnetic core including a first and a second outer leg, and a third inner leg between the first and second outer legs, a first and a second winding respectively wound on the first and second outer legs, and a third winding wound on the third inner leg. The first and second windings are electrically coupled and comprise a first inductive winding. The first inductive winding does not generate any effective magnetic flux through the third inner leg. The third winding forms a second inductive winding. At least one of the first, second and third windings is a composite winding and comprises at least one embedded capacitor.

Abstract: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160?), with each circuit unit (160?) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160?) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.