Abstract: A safe and effective therapeutic method for treating malaria. To accomplish treatment , anti-parasite agents are administered which consist of dequalinium salts. The salts are highly effective against chloroquine resistant/sensitive strains of human P. falciparum at low concentration levels.

Abstract: A magnetic latching actuator is disclosed having an arrangement of components which cooperate to minimize internal friction, while ensuring smooth and efficient operation. The invention uses a core having at least one electrical coil. In communication with the core is a permanent magnet. The magnet is positioned against a U-shaped magnetic flux connector having two parallel plates. The plates are sufficiently spaced from each other to permit the passage of a U-shaped armature therebetween. The armature is movable between the plates of the flux connector, enabling the transfer of magnetic flux to the armature while avoiding frictional engagement between the armature and flux connector. The armature further includes two end portions each designed to alternately engage the core at opposite ends.

Abstract: A method for removably securing the leads of a semiconductor package to the conductive pathways on a circuit board is disclosed. Specifically, a retaining member is provided which includes a plurality of bores each sized to receive a pressure pin. Each pin communicates with a biasing system, enabling the resilient movement of each pin independently of the other pins. The retaining member and pins are positioned above the semiconductor package on the circuit board, and subsequently urged downward so that each pin contacts one of the leads on the package. As a result, the proper pressure is applied to each pin so that it effectively communicates with its designated conductive pathway on the circuit board.

Abstract: The present invention involves a metal alloy heat sink containing tungsten, copper, and nickel. The heat sink is affixed to a ceramic substrate which supports one or more heat-generating electrical components. By adjusting the ratio of tungsten, copper, and nickel, substantial matching of the heat sink CTE with the substrate CTE is possible. Because the CTE of the heat sink is matched with that of the substrate, problems associated with differential thermal expansion are minimized, including micro-cracking and delamination. In addition, the completed heat sink has a relatively high thermal conductivity, and is capable of dissipating substantial amounts of heat.

Abstract: An apparatus for controlling the pressure exerted on a probe in an integrated circuit testing station is disclosed. The apparatus is mounted to a support structure within the station directly above the probe. The testing station further includes a motorized lift system for moving an integrated circuit upward against the probe for testing. The invention uses a pressure pad positioned directly above the probe which is attached to the support structure using a resilient member. Associated with the pad is an electrical contact system connected to the lift system. As the lift system moves the circuit upward, it contacts the probe which pushes against the pad. Movement of the probe and circuit against the pad permits secure engagement of the probe with the circuit. As the circuit continues to move upward, the pad is urged upward, causing the electrical contact system to deactivate the lift system before damage to the probe occurs.

Abstract: A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed within the package. The packaged resistor is then thermally calibrated at a plurality of temperature levels to generate a linear temperature versus resistance graph or equation corresponding thereto. Next, voltage is applied to the packaged resistor causing such resistor to "self heat." Its resistance is calculated, and the temperature corresponding thereto is obtained from the graph or equation. Such temperature is the surface temperature of the resistor. This temperature may then be used to calculate the temperature gradient from the inside of the package to any reference point on or near the outside of the package, the temperature of which has been previously determined.

Abstract: A new and efficient method for attaching an optical fiber to a substrate to form a structurally secure optical fiber package is disclosed. The method first involves coating an optical fiber with an external layer of gold. A silicon retaining member is then provided having a groove therein sized to retain and receive the coated optical fiber. The silicon retaining member and optical fiber are then positioned on a substrate preferably constructed of alumina. Deposited on the substrate is at least one metal pad having an external gold layer on which the silicon retaining member is placed. The optical fiber, silicon retaining member, and substrate are then heated at a temperature sufficient to form a silicon/gold eutectic alloy between th silicon of the retaining member and the gold layers of the optical fiber and pad. Such heating involves a temperature of at least 370.degree. C. Heating is preferably accomplished using a resistor secured to the underside of the substrate.

Abstract: A pressure sensing apparatus for use in an integrated circuit testing station is disclosed. The testing station includes a probe, a support structure, and lift means for moving an integrated circuit upward toward the probe. The invention specifically consists of a pressure pad secured to the support structure directly above the probe. The pad includes a resilient body portion having a rigid tip. Embedded within the pad is a piezoelectric element having electrical contact leads attached thereto. When the testing station is used, an integrated circuit is moved upward by the lift means toward the probe. As the circuit contacts the probe, it moves the probe upward. As the probe moves upward, it pushes on the pad, causing internal pressures to be generated therein. Such pressures are transmitted to the piezoelectric element which generates electrical impulses proportional to the pressures exerted on the pad.