Patents Represented by Attorney Jay P. Freidenson

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  • Electroless plating of substrates
    Patent number: 5292557
    Abstract: Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.
    Type: Grant
    Filed: November 16, 1992
    Date of Patent: March 8, 1994
    Assignee: Allied-Signal Inc.
    Inventor: Larry D. Olson