Abstract: Apparatus are shown for handling molded leadframes comprising, in combination, a gripper portion for grasping a molded leadframe from atop a first magazine holding a first plurality of molded leadframes and for releasing the molded leadframe when placed atop a second plurality of molded leadframes in a second magazine, and a mover portion coupled to the gripper portion for moving the gripper portion back and forth in a substantially semicircular motion between the first and second magazines. The mover portion includes a linking member coupled to the gripper portion, a first member rotatably coupled at a first end thereof to the linking member, a second member rotatably coupled at a first end thereof to the linking member, and a driver portion rotatably coupled to an opposite end of each of the first and second members for moving the gripper portion in a back and forth, substantially semicircular motion between the first and second magazines.