Patents Represented by Attorney Jeffrey K. Beyer & Weaver, LLP Weaver

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  • Device and method for reducing thermal cycling in a semiconductor package
    Patent number: 5901043
    Abstract: In semiconductor packaging, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die. A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: May 4, 1999
    Assignee: National Semiconductor Corporation
    Inventors: Peng-Cheng Lin, Hem P. Takiar