Abstract: A protection device, circuit, and a method of forming the same. A field oxide drain extended nMOS (FODENMOS) transistor (10) is located in an epitaxial region (16). The FODENMOS transistor (10) comprises a field oxide region (36a) that extends from the source diffused regions (22) to over a portion of the extended drain region (20). A drain diffused region (24) is located within the extended drain region (20). A gate electrode (40) may be located above the field oxide region (36a) if desired. Accordingly, there is no thin oxide interface between the gate electrode (40) and the extended drain region (20) that can lead to low ESD protection.