Patents Represented by Attorney Jim McDaniel

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  • 3D interconnect with protruding contacts
    Patent number: 7262495
    Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: August 28, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Zhizhang Chen, Neal W. Meyer