Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Type:
Grant
Filed:
September 11, 2003
Date of Patent:
March 22, 2005
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Inventors:
John H. V. Roberts, David B. James, Lee Melbourne Cook
Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Type:
Grant
Filed:
September 11, 2003
Date of Patent:
January 18, 2005
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Inventors:
John H. V. Roberts, David B. James, Lee Melbourne Cook
Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Type:
Grant
Filed:
November 10, 2000
Date of Patent:
January 27, 2004
Assignee:
Rodel Holdings, Inc.
Inventors:
John H. V Roberts, David B. James, Lee Melbourne Cook
Abstract: This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.
Type:
Grant
Filed:
May 8, 1998
Date of Patent:
February 1, 2000
Assignee:
Rodel Holdings Inc.
Inventors:
John V. H. Roberts, Lee Melbourne Cook, David B. James, Heinz F. Reinhardt
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