Abstract: A temperature responsive electric switch is shown having an operating bimetallic member adapted to sense the temperature of a heat source coupled to an over-center switch mechanism and an ambient temperature bimetallic member to maintain a predetermined temperature delta in the operation of a thermostat regardless of changes in ambient temperature.

Abstract: The bond of a layer of glass dielectric material applied to metal substrates of the type which are capable of forming solid solutions with copper is enhanced by first coating the substrate with a layer of thick film copper, curing the thick film at a temperature which results in the formation of the solid solution at the interface between the substrate and the thick film copper and then applying the dielectric layer to the thick film copper and curing the dielectric layer. Circuit patterns and components can then be built on the dielectric layer.

Abstract: A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together.

Abstract: A presure sensor for providing an electrical signal corresponding to pressure in a cylinder of an automotive engine has a rigid load-spreading element rigidly secured to a first surface of a ceramic piezoelectric body by a rigid bonding material precisely conformed to the first surface to be in substantially uniform load-transferring relation to all parts of the first body surface, has a rigid support member rigidly secured to a parallel, opposite surface of the ceramic piezoelectric body by a rigid bonding material precisely conformed to the opposite surface to be in substantially uniform load-transferring relation to all parts of the opposite body surface to form a piezoelectric unit and has a peripheral part of the rigid support member precisely mounted with an interference fit in a bore in a metal component of a mounting structure so that the body of a piezoelectric material and the load-spreading element extend in a cantilever relation at a precisely determined location to be engaged by force applied thr

Abstract: The device is intended to be used for recording the position reached by a moving part, such as the arm of an industrial robot moved by a rotary motor (M). The device comprises, in an assembly capable of being associated with the said moving part, an angular-position transducer such as a resolver (2), capable of generating at least one signal (4, 5) indicating the position reached by the motor (M) during a rotation, counting means (12) connected to the angular-position transducer (2), capable of storing a cumulative count of the signal generated by the transducer (2) itself and indicating the position reached by the moving part, and power supply means such as a buffer battery (18) capable of keeping the position transducer (2) and the counting means (12) active even when there is no external power supply.

Abstract: A dual function circuit board substrate has a layer or sheet of ultrathin metal of relatively high electrical resistivity having a selected sheet resistivity characteristic bonded to a thin layer or sheet of metal of relatively high electrical conductivity. The layer of high electrical resistivity material is adhered to one side of a layer of organic electrically insulating material, and a heat-sink metal layer is adhered to an opposite side of the organic insulating layer to withdraw heat from the layer of high electrical resistivity material. The thin layers of high electrical resisivity and conductivity materials are selectively etched from the organic layer material to form a select circuit, and the layer of high electrical conductivity material is selectively etched from portions of the circuit to form one or more resistor elements having selected electrical resistances in the circuit.

Abstract: A method of forming an enclosure for an electric circuit and the enclosure wherein there is provided a boat of material having a bottom and side wall, placing a material having a substantially higher thermal conductivity and a lower melting point than that of the boat in the boat bottom, heating the material to a temperature above the melting point thereof and below the melting point of the boat to cause the material to flow along the bottom to form a layer of the material thereon and join the layer to the bottom and side wall and removing a sufficient amount of the bottom of said boat to expose the layer. In accordance with a second embodiment, a depression is formed in the bottom, and when the material flows along the bottom, it fills the depression and become joined to the bottom. Plural such depressions can be provided. The exterior portion of the bottom is removed to expose the material if the depressions do not extend completely through the bottom.

Abstract: Differentially connected capacitive sensors are mechanically coupled with the flexible capacitor plate of one sensor coupled to the source of pressure to be measured, the flexible capacitor plate of the other sensor coupled to ambient pressure. In a second embodiment, inaccuracies due to forces on the flexible plate are minimized by providing a housing with a tapered inner wall, an O-ring and a support to apply a radial load to the sensor due to clamping action from the tapered housing against the O-ring to provide a seal for the pressure sensing chamber. In a further embodiment, the cost of fabrication of the pressure transducer is minimized by providing the housing as a one piece cup. The electronics are mounted on the exterior surface of the low pressure side of the ceramic capacitor pressure sensing element and sealed in thereat by potting with an epoxy.

Abstract: A pressure sensing element having a housing including a flexible membrane receiving portion, a flexible disc member of predetermined shape secured within the housing, and a flexible membrane disposed within the housing, the flexible membrane being substantially more flexible than the disc member, the membrane having an outer portion hermetically secured to the membrane receiving portion, a central portion impinging against the disc member and conforming to the shape thereof and an intermediate unsupported portion joining the interior portion of the outer portion and the exterior portion of the central portion.

Abstract: A motor protector having a can and an internal electrical contact is hermetically sealed to a disk-shaped header of conductive material, the header having a flattened edge for orientation in the can during fabrication of the protector and having spaced conductive pins sealed in and insulated from the header. A heater-support having holes for fabrication is bonded to one conductive pin, a bimetallic element on the support has a plane parallel to the axes of the pins and has a contact element normally contacting the can contact. A heater is bonded to each of the electrically conductive pins spaced from the movable contact and in a plane parallel to the axes of the conductive pins. In making the motor protector a fixture has one depression with pins mating with the support apertures and has a second depression receiving the header in an upright position and adjacent the first depression.

Abstract: A transducer arrangement comprising a magnetoresistive transducer including a magnetoresistive element responsive to magnetic flux passing therethrough in a predetermined direction to change its electrical resistance as a function of the intensity of the magnetic flux in the predetermined direction and a magnet to provide said magnetic flux. The transducer can include a permanent magnet having a planar surface with a magnetoresistive element offset from the axis of the magnet and optionally at an angle to the planar surface. The transducer can also include a concave surfaced magnet with the magnetoresistive element at an acute angle to the parallel flux lines emanating from the concave surface. As a further embodiment, the magnetoresistive element can be tilted on the magnet surface in two directions to provide a bias field and calibration.

Abstract: A socket for testing integrated circuit units has contact elements and holding members movable on a body and has a cover reciprocable toward the body to move the contact elements and holding members in selected sequence for receiving an integrated circuit unit in a carrier on the body and away from the body to permit the holding members to engage the carrier and to permit the contact elements to engage terminals on the integrated circuit on the carrier for releasably connecting the terminals in a test circuit.

Abstract: A normally open pressure responsive switch having upper and lower housings with a snap acting member and an electrically conductive member sandwiched therebetween. The housings each include a body with a hollow center portion and the lower housing has a contact in the center portion extending externally of the member. The snap acting member is in constant engagement with the sandwiched conductive member and normally out of engagement with the contact. When pressure is applied which is sufficient to cause the snap acting member to snap connection is made with the electrically conductive member in the lower assembly. An elastomeric sealing member is mounted in the upper housing and has a neck portion received in the hollow center portion, an integrally attached flange biased against the electrically conductive member and lower housing and an integrally attached lobe extending above the upper housing to seal off the hollow center portion when the switch is mounted at a switch receiving seat.

Abstract: A member of selected shape embodying a refractory metal material such as a titanium aluminide preferably having reinforcing elements disposed therein is provided by combining constitutents of the refractory metal material surrounding the reinforcing elements, by consolidating the constituents and elements and forming them into the selected shape, and by reacting the constituents with each other for forming the refractory metal material in situ within the selected shape, at least one of the constituents also preferably being reacted in situ within the selected shape with metal material of the reinforcing elements for forming an intermetallic compound which securely holds the reinforcing elements in position within the selected shape.

Abstract: A pressure responsive switch having upper and lower contact assemblies with a snap acting member and an electrically conductive member sandwiched therebetween. The assemblies each include an insulating body with a hollow center and an electrically conductive member having a contact in the center portion and extending externally of the body. The snap acting member is in constant engagement with the sandwiched conductive member and normally in engagement with the electrically conductive member of the upper assembly. When a pressure is applied which is sufficient to cause the snap acting member to snap into its second stable state, the connection thereof with the electrically conductive member in the upper contact assembly is broken and connection is made with the electrically conductive member in the lower assembly. The switch is normally closed by removing the portion of the electrically conductive member in the lower assembly which extends externally thereof.

Abstract: A three pole relay which operates in response to the flow of normal operating current across fluorescent lamps to activate a coil, the coil coperating a relay to open switches disposed in all of the filament lines associated with the lamp to shut off filament current while maintaining current flow across the lamps themselves.

Abstract: A thermostat having an electrically insulating housing and a push button extending therein through a bottom wall thereof. Two normally closed contacts, one fixed and the other on a movable carrier with a projection are disposed within the housing. A spring member pivotable about its center portion has an end resting against the push button and an opposite end resting against the movable contact carrier. An electrically insulating sheet is disposed over an open end of the housing with a convex outwardly bimetallic disc over and external to the insulating sheet and a cap disposed over the disc to enclose the disc within the housing. In an alarm status, the disc becomes convex inwardly and pushes against the projection on the movable contact carrier to separate the contacts.

Abstract: A pressure or temperature responsive switch wherein the high temperature environment at the measuring portion of the switch is thermally isolated from other portions of the switch which are incapable of operation at such high temperatures, thereby providing a relatively low cost switch with the desired capability. There is also provided a pressure or temperature responsive switch as noted above which is assembled by friction fit among the parts and without rivets or the like. Furthermore, the materials used permit waterproof sealing by the use of shrink tubing which bonds to the wire insulation.

Abstract: Subject-matter of this invention is a method for assembling components, such as M.O.S, devices and the like, upon printed circuit boards by clinching, such method including the steps of providing a board bearing a printed circuit with places upon which a component is to be assembled; applying the component upon the board with its pins in contact with the places of the circuit among which it is to be assembled; pressing the component in order that the pins are forced to penetrate through the thickness of the board; and clinching the end portions of the pins protruding from the back side of the board.

Abstract: A circuit having a semiconductor device therein has a novel and improved circuit substrate comprising a layer of organic electrically insulating material having a layer of metal of relatively high electrical conductivity adhered to and supported on one side of the organic material layer forming electrically conductive circuit paths and forming a pad mounting the semiconductor device. A heat sink metal layer is adhered to and supported on an opposite side of the organic material layer for withdrawing heat from the semiconductor device.