Patents Represented by Attorney John A. Molnar, Esq.

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  • Heat dissipator for electronic components
    Patent number: 5550326
    Abstract: A low profile heat dissipator for low power IC packages which is formed of a metal, thermally conductive layer, zero, one or two electrically insulative layers positioned on one or both major surfaces of the metal layer, and an adhesive pad which bonds the dissipator to the surface of the electronic component. The dissipator may have a series of score lines formed in its surfaces which allows portions of the dissipator to be bent or removed so as to conform to the available space.
    Type: Grant
    Filed: July 13, 1994
    Date of Patent: August 27, 1996
    Assignee: Parker-Hannifin Corporation
    Inventor: Bradley K. Kesel