Abstract: A semiconductor dynamic read/write memory device contains an array of rows and columns of one-transistor memory cells, with a differential sense amplifier for each column of cells. The sense amplifier has a pair of balanced bit lines extending from its inputs, in a quasi-folded bit line configuration. The memory cells are not directly connected to the bit lines, but instead are coupled to bit line segments. The row address selects a cell to be connected to a segment, and also selects one of the two segments to be connected to one of the two bit lines. Instead of being interleaved one-for-one, the word lines for cells to be connected to the two bit lines are in groups one group for each segment line; the groups are interleaved. The combined segment line and bit line capacitance has a more favorable ratio to the storage capacitance, compared to the one-for-one interleaved layout.

Abstract: A chip carrier with multiple through hole vias in its hermetic sealing lid. One or more chips is mounted on the inner surface of that lid. The lid contains multiple through vias, and the semiconductor chip on the inner surface of the lid is bonded to the vias in the lid by TAB strips or (optionally) by wire bonds. The vias in the lid connect these leads through to contacts on the outer surface of the package. These contacts can than be connected to (using interconnect structures such as TAB strips, or printed wiring boards, or discretionary wiring), to provide circuit interconnection. Preferably low-power-dissipation chips are mounted on the inner surface of the lid in this fashion, with higher-power-dissipation chips mounted on the bottom surface of the chip cavity.

Abstract: In video computer system having a dual-port bit-mapped RAM unit incorporating a shift register, provision is made for coupling data between column lines and the shift register, and for simultaneously preventing any column line from being coupled with the random data output terminal of the RAM unit. Accordingly, this prevents two or more different data bits from appearing simultaneously from the RAM unit and causing confusion as to which is the valid signal and which is a spurious signal.

Abstract: A chip carrier including a connecting strip is supported by a thermally conductive spacer block under its center, which provides a mechanical connection to a circuit board. The external contact pads on the underside of the chip carrier are not bonded directly to traces on the board, but instead are bonded to the connecting strip which is formed from a polymer layer having conductive traces thereon. The conductive traces may be bonded to traces on the circuit board.

Abstract: A semiconductor read/write memory device has a normal mode of operation and a test mode. The test mode allows concurrent writing to a number of cells in the cell array so that test patterns may be rapidly loaded. The cell array is split into subarrays and the column addressing circuitry is arranged to provide a maximum of spacing between the cells that are concurrently written. In this manner, pattern sensitivity tests may be run at higher speed because a number of bits at widely spaced positions in the array can be tested simultaneously.

Abstract: A dual-port memory which features a pipelined serial port is disclosed. The serial side of the dual-port memory contains a ripple counter which is broken between predetermined stages. The contents of the stages above the break are decoded to select a group of bits of the serial register for output, and the contents latched in a latch. In serial output, the contents of the stages below the break are decoded, so that responsive to the stages below the break reaching a certain value, the stages above the break are incremented and the incremented value decoded. Pass transistors between the register and the latch are turned off during such time as the incremented value is being decoded, so that the new value will not disturb the output. The latched output is selectively presented by a multiplexer which selects the latch bits responsive to the value of the stages below the break. Upon the value of the stages reaching its minimum value (i.e.

Abstract: An N-channel MOS random access memory of the one transistor type is disclosed. The cell utilizes an ion implanted area beneath the capacitor dielectric to permit lower bias voltages on the capacitor. In one example, two levels of polycrystalline silicon are used, one for the bias voltage side of the storage capacitor, and the other for the gate of the MOS transistor and to connect the gate to the bit select line. The capacitor dielectric may be formed of thermal silicon oxide which is about half as thick as the gate insulator of the MOS transistor in the cell. In another example, a single-level poly cell uses an implanted region for the same purpose; the capacitor dielectric is the same thickness as the MOS gate insulator so the lower bias voltage functions to reduce stress failures of the dielectric.

Abstract: A dual-port memory having a special operating mode (i.e., a block write mode) by which a plurality of memory cells may be written with the same data in a single write cycle is disclosed. The special mode is enabled by a special function pin in conjunction with the write enable and transfer enable function pins, each of which have their logic state latched in during the row address strobe signal. The column decoder in this device is in two stages, where the first stage selects a group of columns based upon the most significant column address bits. The second stage selects a single column based upon the least significant column address bits. In the block write mode, the result of the second column address decoder stage is ignored, and another set of signals select one, more than one, or all of the columns in the group for connection to the input/output circuitry, so that the same data is written to a plurality of memory locations within a certain column address proximity.

Abstract: A scheme for addressing memory cells in random access memory arrays includes bit lines divided into a plurality of segments. Each pair of bit lines has a sense amp at each end coupled to both bit lines in the pair. Word lines address memory cells coupled to each bit line of the pair. When a pair of memory cells is accessed, the bit lines are electrically divided so that one memory cell is coupled to one sense amp through one bit line, and the other memory cell is coupled to the other sense amp through the other bit line. The memory cells can be coupled to the bit lines through segment lines, with each segment line connecting a subset of the memory cells to a bit line, in order to reduce capacitances presented to the sense amps. An alternating linear array of sense amps and bit line pairs can be used to increase overall density of the memory array by allowing sense amps to access more than one bit line pair. The bit lines are addressed so that each sense amp receives data from one one bit line pair at a time.

Abstract: A semiconductor memory is comprised of four arrays (10), (12), (14) and (16) that have the memory elements therein arranged in accordance with pixel positions on a display. The memory arrays have associated shift registers (34), (36), (38) and (40) which have data loaded in parallel and output in a serial format to the display. Each of the shift registers can be connected in a circulating fashion or a shift register of adjacent arrays can be cascaded. Switches (56), (58), (60) and (62) are provided for configuring the shift registers for either circulation or cascading of data. In the circulating mode, the input and output of the shift registers is multiplexed on one pin whereas in the cascaded configuration, one array receives a dedicated serial input and the other array in the cascaded pair outputs the serial output on a dedicated pin.

Abstract: A CMOS sense amplifier for a dynamic read/write memory employs a latch circuit with cross-coupled N-channel transistors and cross-coupled P-channel transistors, returned to the voltage supply and ground through P and N channel transistors selectively activated by sense clocks. Differential inputs of the sense amplifier are connected to the bit lines. The N-channel transistors are employed for initial sensing, and then both N-channel and P-channel transistors in sequential order for amplification and restoring the I-level. This results in better balance, and smaller N and P channel latch transistors may be used, saving area, saving power and increasing speed.