Abstract: This invention is a simplified method of digitally monitoring energy in a system. The power is measured at fixed periods, and the measurements summed in a register or accumulator. When the sum in the register or accumulator is equal to a specified energy divided by the fixed sample period a signal is generated. In power controllers or solid state power controllers (SSPC), this algorithm is used to the maximum energy load (I2t). In a solid state switch, this algorithm is used to monitor the energy in a switch and generate a signal when the exceeds a specified safe operating limit.

Abstract: This is an interconnection between electronic devices and other assemblies (e.g. printed circuits). The electronic devices are mounted on high temperature insulating bases, such as ceramic substrates. The insulating base has a conductive pattern to connect the electronic device to another assembly. The conductive pattern terminates in metal bumps capable of being connected to another assembly (e.g. a printed circuit) by a conductive adhesive or metallurgically by soldering, thermocompression, thermosonic or ultrasonic bonding. The bumps are formed by applying a metal with a melting point over 350° C. to contact pads of the conductive pattern of the insulating base, and raising the temperature of the base above the melting point of the metal causing the molten metal to draw back on to the contact pads forming a convex bump.

Abstract: A method of forming bumped substrates with protuberances for inverted or flip-connection bonding of electronic devices including semiconductor devices, integrated circuits, and/or application specific integrated circuits and electromechanical devices. The substrates are high temperature insulating materials provided with a conductive pattern. The conductive pattern has contact areas corresponding to the input/output (I/O) pads of the electronic device. A metal is applied over the contact areas, and the temperature is raised above the melting point of the metal causing the metal to melt and draw back into a convex protuberance over the contact areas. The convex protuberances are suitable for connecting to the electronic devices by conductive adhesive bonding or metallurgically bonding such as thermocompression, thermosonic or ultrasonic bonding.

Abstract: A compact, rugged, optocoupler which is a self-contained package. The optocoupler has a photon emitter mounted on the conductive pattern of a first, inorganic substrate, and a photon detector mounted on the conductive pattern of a second, inorganic, insulating substrate. The first and second substrates are bonded to an inorganic frame to form a cell containing a photon emitter opposite a photon detector. The first and second substrates and the frame also constitute the walls of the self-contained package. The optocoupler package may be manufactured with one or multiple cells in a package.