Abstract: A solder flux composition (19) is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.
Abstract: A high solids spin finish composition is provided that can be readily applied to synthetic fibers during the fiber-making process. The spin finish composition comprises a hydrocarbon surfactant and a fluorochemical emulsion.
Type:
Grant
Filed:
August 8, 2000
Date of Patent:
March 25, 2003
Assignee:
3M Innovative Properties Company
Inventors:
Irvin F. Dunsmore, James R. Lockridge, Edward R. Hauser, Chetan P. Jariwala