Abstract: A probe assembly comprising a frame and at least one contact carrier within the frame wherein the carrier has a plurality of tie strips and a plurality of contacts and each contact is contiguous with a corresponding group of tie strips. Each contact becomes discontiguous from the corresponding group of tie strips when a force is applied to the tie strips. The probe assembly further comprising at least two rails attached to the frame. Each rail has a top portion for receiving the contacts and tie strips and a bottom portion having a plurality of regions for contacting the tie strips. The carrier is positioned between the top portion of one of the rails and the bottom portion of the other rail. When a compressive force is applied to the rails and carrier, the regions forcibly contact the tie strips such that all the contacts simultaneously become discontiguous from the tie strips.
Type:
Grant
Filed:
June 28, 1996
Date of Patent:
March 17, 1998
Assignee:
International Business Machines Corporation
Inventors:
Joseph M. Sullivan, Emanuele F. Lopergolo
Abstract: An ion milling end point detection method for etching coated substrates is disclosed comprising the use of a light measurement of light passing through a monitor substrate (e.g., glass coated with the same material at about the same thickness as the coated substrate to be etched) during the milling process, comparing the light values with a reference value and determining the end point of the milling process based on said values. Coated and uncoated monitor substrates may also be employed together and the values compared to determine the end point. An apparatus for determining the end point of an ion milling process is also disclosed.
Type:
Grant
Filed:
June 20, 1994
Date of Patent:
November 25, 1997
Assignee:
International Business Machines Corporation
Inventors:
William Harrington Brearley, Donald Charles Forslund, Douglas William Ormond, Jr., Gerald Joseph Sliss
Abstract: A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery of the component to a chip on the electronic component.
Type:
Grant
Filed:
October 10, 1995
Date of Patent:
September 23, 1997
Assignee:
International Business Machines Corporation
Abstract: A mask for printing a pattern on a substrate comprises a sheet preferably of metal having a printing pattern thereon comprising through mask openings in the sheet. The through mask openings are interconnected by tabs or bridges which have a structure which provides a bending moment in a portion of the tab when a force is applied to the mask to force material to be deposited on the substrate through the mask openings. A preferred tab structure has a step shape and at least one through opening in the tab. The step shape and through mask opening both provide bending moments in the tab and the through opening also provides enhanced patterning definition because the deposition material flows both under the tab and through the through tab opening. The masks have a longer operating life than conventional masks and enhanced operating characteristics.
Type:
Grant
Filed:
April 27, 1995
Date of Patent:
September 23, 1997
Assignee:
International Business Machines Corporation
Inventors:
Harry David Cox, Connie Fassett Littell, Richard Michael Shroedl, John Amodio Trumpetto, Michael Stephen Vanca