Abstract: The coating thickness and uniformity of spin-on deposition layers on semiconductor wafers is controlled through the in situ control of the viscosity and homogeneity of the mixture of precursor material and solvent material. The thickness of the deposited material is selected and the viscosity required at a given spin rate for the selected thickness is automatically mixed. Sensing and control apparatus are employed to ensure that the uniformity and viscosity required is maintained before dispensing onto said semiconductor wafer. Low-K dielectric materials of selected thickness are deposited in a uniform coating.

Abstract: An oxynitride material is used to form shallow trench isolation regions in an integrated circuit structure. The oxynitride may be used for both the trench liner and trench fill material. The oxynitride liner is formed by nitriding an initially formed oxide trench liner. The oxynitride trench fill material is formed by directly depositing a high density plasma (HDP) oxide mixture of SiH4 and O2 and adding a controlled amount of NH3 to the plasma mixture. The resultant oxynitride structure is much more resistant to trench fill erosion by wet etch, for example, yet results in minimal stress to the surrounding silicon. To further reduce stress, the nitrogen concentration may be varied by varying the proportion of O2 to NH3 in the plasma mixture so that the nitrogen concentration is maximum at the top of the fill material.

Abstract: An oxynitride material is used to form shallow trench isolation regions in an integrated circuit structure. The oxynitride may be used for both the trench liner and trench fill material. The oxynitride liner is formed by nitriding an initially formed oxide trench liner. The oxynitride trench fill material is formed by directly depositing a high density plasma (HDP) oxide mixture of SiH4 and O2 and adding a controlled amount of NH3 to the plasma mixture. The resultant oxynitride structure is much more resistant to trench fill erosion by wet etch, for example, yet results in minimal stress to the surrounding silicon. To further reduce stress, the nitrogen concentration may be varied by varying the proportion of O2 to NH3 in the plasma mixture so that the nitrogen concentration is maximum at the top of the fill material.

Abstract: A multilayer CTE compensated chip interposer for connecting a semiconductor chip to a laminate chip carrier. A first dielectric layer, on the chip side of the interposer, is made of a stiff, high elastic modulus, material, such as a ceramic material, with a CTE closely matching the CTE of the chip. A second dielectric layer, on the laminate chip carrier side of the interposer, is made of resilient, low elastic modulus, material with metallurgy formed thereon, such as circuit board material, with a composite CTE closely matching the CTE of said chip carrier. A third dielectric intermediate layer, laminated between said first and second layers, is made of a low elastic modulus material with metallurgy formed thereon, such as a Teflon/glass particle material, with a composite CTE between the CTEs of said first and second layers.

Abstract: A layout pattern for increasing the spacing between the deep trenches of one cell pair and the deep trenches of an adjacent cell pair in an array of semiconductor DRAM cell pairs each of which cell pairs share a common bitline contact to bitlines arranged in one direction and each of which cell pairs are coupled to gate conductors arranged orthogonal to the bitlines. The layout pattern is formed by positioning the deep trenches of all of said pairs along alternate bitlines so they are offset from said bitlines along gate conductors in opposing directions. The deep trenches of all of the remaining bitlines are offset from said bitlines in opposing directions opposite to the opposing directions of said trenches along said alternate bitlines so as to form a herringbone pattern of cells.

Abstract: A coaxial connector having a conductive copper wire core plated with a layer of gold with the layer of gold surrounded by a dielectric layer, such as polyimide. The layer of polyimide is surrounded by a conductive shielding layer, such as copper, with a tin-plated layer surrounding it. Connection of the coaxial connector at one end to adjacent signal and ground pads is achieved by laser ablation to expose a section of gold sufficient to accommodate the terminal pad pitch and allow wire bonding to the signal pad. Connection of the conductive shielding layer to the ground pad is achieved by hot tip soldering. Connection at the opposite end of the coaxial connector uses the same process.

Abstract: A telephone pay station wherein a disconnect circuit is provided for disconnecting the pay station from the central office in response to the coin collect signal generated at the central office.