Abstract: The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.

Abstract: The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.

Abstract: A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an alkaline solution. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.

Abstract: Polypropylene film coated with a submicron thickness of a composition comprising mitrocellulose is proposed as useful in the production of photopolymer printing plates. In addition to nitrocellulose, the coating composition also preferably comprises a solvent, lecithin and a wax.

Abstract: Disclosed are waterborne, stable photoresist compositions and methods of their preparation and use. The compositions are characterized by increased shear and storage stability. The photoresist composition comprises an aqueous emulsion of a 22% or less neutralized carboxylated resin and non-ionic surfactant containing poly(ethylene-oxide) segments, photopolymerizable monomer and photoinitiator. Neutralization is accomplished using either an organic or an inorganic base or mixtures thereof. The photoresist compositions are useful to selectively coat and protect surfaces subjected to corrosive environments, e.g., etchant processes, in the production of circuit traces for electronic circuit boards.

Abstract: Particular polyurethane photopolymers are disclosed as materials of construction in producing improved polishing pads. The polyurethane photopolymers are formed from a polyurethane prepolymer prepared from the reaction products of a first reactant selected from the group consisting of polyesters, polyethers, polybutadienes and mixtures of the foregoing with diisocyanates, further reacted with acrylates and/or methacrylates.

Abstract: A compressible printing plate is prepared by casting liquid photopolymerizable resin directly onto a compressible material having open cells on its surface. The photopolymerizable resin is incompletely cured by exposure to actinic radiation, preferably in the absence of a coverfilm covering the photopolymerizable resin. A further layer of photopolymerizable resin is then cast onto the incompletely cured resin, and the whole exposed to actinic radiation through an image-bearing transparency. A release composition may be placed between the image-bearing transparency and the photopolymerizable resin to provide for decreased adhesion therebetween. After development, an image-bearing laminate suitable as a printing plate for flexographic printing is obtained. The printing plate achieves excellent short and long term adhesion between the compressible layer and the photopolymer plate, without the necessity of a tie layer or adhesive therebetween.

Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.

Abstract: Acid functional primary thiols having no hydroxy substituents in the beta position, and also having aromatic backbones, can be combined with unsaturated resins to make aqueous base-developable, photoimaging compositions such as solder masks and resists.

Abstract: The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.

Abstract: Highly versatile stable photoresist emulsions can be prepared using low levels of neutralization while minimizing the use of surfactants and associative thickeners. High solids, low viscosity waterborne photoresist emulsion compositions are prepared by mixing and comminuting a partially neutralized acid functional latex polymer resin with photopolymerizable monomers and photoinitiators under conditions sufficient to produce a stable emulsion.

Abstract: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a source of holide ions and optionally a water soluble polymer in order to increase the adhesion of polymeric materials to the metal surface.

Abstract: The addition of vinyl ethers to photosensitive resins is suggested to improve the resistance of the cured resin to polar solvents. Long chain vinyl ethers such as octadecyl vinyl ether or dodecyl vinyl ether are preferred. The resulting photosensitive resin compositions are particularly useful in the fabrication of printing plates.

Abstract: This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.

Abstract: The present invention concerns a mixture of at least one monoester, at least one methyl ester, at least one olefinic hydrocarbon, along with other optional ingredients, which mixture is useful in cleaning organic residues, particularly inks, from various surfaces.

Abstract: A method for cleaning organic residues, particularly inks, from various surfaces. The method involves contacting the surfaces to be cleaned with a composition including n-methyl-2-pyrrolidone, at least one ester alcohol, at least one unsaturated aliphatic hydrocarbon, isoparaffin and dibasic ester along with other optional ingredients.

Abstract: A method for curing a photosensitive resin composition includes use of an especially thin gauge protective cover film, preferably incorporating a coating to permit ease of removal after imaging. The method also uses a photosensitive resin composition incorporating a photospeed modified capping layer to selectively retard image growth during exposure. To eliminate undesirable defects in the cured photopolymer, a glass plate which had previously contacted and flattened the composition, is separated from the composition by at least 0.025 inches after partially curing the composition but prior to completely curing the composition. The partial cure of the composition is achieved by directing light to the composition from a source of actinic radiation positioned about 6 to 30 inches from the resin composition, where the actinic radiation has a wavelength of maximum intensity of about 365 to about 375 nm.

Abstract: A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.

Abstract: A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the substrate and circuit elements with a de-sensitising material; c) forming holes through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; and f) treating the board with a metallic plating solution to deposit conductive metal in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements. This may be in two stages, with an initial thin layer of copper being deposited, followed by a main layer of nickel to the desired thickness.