Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

Abstract: A process for forming a double-sided or multi-layered circuit structure entailing the use of a fill material that forms a conductive connection between the layers of the circuit structure and photodefinable resins that form permanent dielectric layers and plateable surfaces of the circuit structure. The method includes forming a through-hole in a substrate, and then filling the through-hole with the fill material containing a metal that is catalytic to electroless copper. The fill material forms an electrical connection having oppositely-disposed connection surfaces that are coextensive with opposite surfaces of the substrate. A first photodefinable dielectric layer is then formed on each surface of the substrate, including the connection surfaces, and openings are photoimaged and developed in the dielectric layers to expose a portion of each connection surface.

Abstract: A micro-turbo generator device (10) includes a housing (12), a rotor (14), a plurality of stator cores (16), and coils (18) encircling the stator cores. The housing (12) includes a shaft (34) which has an axis (11). The rotor (14) is rotatably mounted onto the shaft (34) and includes a perimeter (32) and a plurality of rotor poles (24) extending generally radially about the axis (11). Each rotor pole (24) includes a magnetizable tip (30) and a concave fluid impact surface (26). The stator cores (16) are disposed about the rotor (14) and include first pole face (15) and second pole face (17) facing the perimeter (32) of the rotor (14) and spaced apart therefrom. The coils (18) helically encircle the stator cores (16) and conduct electrical current to magnetize the stator cores (16) to magnetize the tips (30) and to alternately conduct induced electrical current generated in response to changes in magnetic flux between the first and second pole faces (15, 17) and the magnetizable tips (30).

Abstract: A device (10) for manipulating a wound coil (18) includes a mechanism for grabbing a wound coil (18), a first pair of opposed fingers (12), and a second pair of opposed fingers (14). The first pair of opposed fingers (12) oppositely engage a start lead (20) of the wound coil (18) and move along an arc from a first position where the start lead (20) is tangential to the inner circumference of the wound coil (18) to a second position where the start lead (20) is chordal to the inner circumference of the wound coil (18). The second pair of opposed fingers (14) oppositely engage a finish lead (22) of the wound coil (18) and move along an arc from a first position where the finish lead (22) is tangential to the outer circumference of the wound coil (18) to a second position where the finish lead (22) is chordal to the outer circumference of the wound coil (18).

Abstract: A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26).

Abstract: A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20).