Abstract: A semiconductor device structure includes a gate structure disposed on a portion of substrate, source and drain regions disposed adjacent to the portion so as to form a channel region in the portion, and trench isolation regions located immediately adjacent to the source and drain regions. At least portions of the trench isolation regions include stress materials such that the materials generate shear stresses in the channel region.
Type:
Grant
Filed:
January 12, 2005
Date of Patent:
September 25, 2007
Assignee:
International Business Machines Corporation