Abstract: A parallel-plate heat pipe is disclosed that utilizes a plurality of evaporator regions at locations where heat sources (e.g. semiconductor chips) are to be provided. A plurality of curvilinear capillary grooves are formed on one or both major inner surfaces of the heat pipe to provide an independent flow of a liquid working fluid to the evaporator regions to optimize heat removal from different-size heat sources and to mitigate the possibility of heat-source shadowing. The parallel-plate heat pipe has applications for heat removal from high-density microelectronics and laptop computers.
Type:
Grant
Filed:
April 30, 2002
Date of Patent:
December 7, 2004
Assignee:
Sandia Corporation
Inventors:
Michael J. Rightley, Douglas R. Adkins, James J. Mulhall, Charles V. Robino, Mark Reece, Paul M. Smith, Chris P. Tigges