Patents Represented by Attorney John P. Sumner
  • Patent number: 5852557
    Abstract: The present invention is a DC to AC switching converter that does not require a dead zone. The output node of the classical switching pair is separated into two output nodes which eliminates the current path that made the dead zone necessary. Each of the switches are connected between +Edc and -Edc in a complimentary fashion. By eliminating the direct connection between the two switches, both switches can be operating simultaneously without any danger of failure. Both switch outputs pass through a current sensing feedback device and an output coil. The outputs of each coil are connected to the output of the switching converter having a filter capacitor connected to ground. This arrangement provides switching bias current during the zero current crossover point thereby eliminating the ringing and oscillation distortion that occurs in the dead zone. The desired output voltage waveform is a result of the summation of the two switch outputs after the high speed component has been removed through filtering.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: December 22, 1998
    Assignee: Pacific Power Source a Division of Thermo-Voltek
    Inventor: Mark Woodward
  • Patent number: 5590185
    Abstract: The present invention is a two line phone adaptor that allows two separate phone lines to be connected to and controlled by a single line DTMF phone. The two line phone adaptor has one ring detector for each line and one hold circuit for each line. The adaptor also has an electronic line selector circuit, a DTMF decoder and an off hook detector. All of the above circuits are connected to a micro controller that contains the software that defines the functions of the adaptor. The adaptor does not have any user accessible control buttons except for an on/off switch. The adaptor will automatically engage the `ringing line` and transfer the ring signal to the attached phone to generate an audible ringing sound. When the phone is taken off the hook, the adaptor will automatically seize a `free line` for use. The adaptor is controlled by the 3.times.4 keyboard of the attached DTMF single line phone and provides the functions such as music on hold, manual line select and three party conferences.
    Type: Grant
    Filed: March 25, 1995
    Date of Patent: December 31, 1996
    Inventors: Harold Sandler, Kendy Ip
  • Patent number: 5572647
    Abstract: A system and method for automatically repositioning and/or resizing scroll bars and other control constructs within a computer window environment. The system monitors the control constructs corresponding to open windows on the display device in order to determine if any of the control constructs are at least partially obstructed or not controllable. This monitoring may occur during each refresh of the display device. If any of the control constructs are not visible or controllable, the system automatically repositions and/or resizes the control construct so that it is visible and/or may be controlled by an operator.
    Type: Grant
    Filed: November 4, 1994
    Date of Patent: November 5, 1996
    Assignee: International Business Machines Corporation
    Inventor: Jerry A. Blades
  • Patent number: 5557273
    Abstract: An electrical system for converting a magnetic azimuth detector (MAD) signal into a corresponding digital signal. A conversion circuit receives a three-wire signal from the MAD; the three-wire signal is proportional to an angle .theta., which indicates the position of the MAD relative to magnetic north. The conversion circuit converts the three-wire signal into sin .theta. and cos .theta. signals. A digitization circuit converts the sin .theta. and cos .theta. signals into corresponding digital signals by first half-wave demodulating the analog sin .theta. and cos .theta. signals, then low-pass filtering the signals to extract the DC components, and finally digitizing the analog DC components.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: September 17, 1996
    Assignee: Honeywell Inc.
    Inventor: Steven J. Catanach
  • Patent number: 5519413
    Abstract: A method and apparatus for concurrently scanning and filling a memory comprised of at least a first and a second memory partition for use in a video display of the ping-pong type is provided herein. A method according to the present invention includes scanning the first memory partition and concurrently filling the second memory partition, such that a fill pattern is stored in every memory cell in the second memory partition during a time period in which a portion of memory cells in the first memory partition are scanned. A method in accordance with the invention can be incorporated into a video display system with minimal modifications to provide a fast fill or clear of a memory partition.
    Type: Grant
    Filed: November 19, 1993
    Date of Patent: May 21, 1996
    Assignee: Honeywell Inc.
    Inventors: Larry J. Thomas, Douglas E. Thorpe
  • Patent number: 5442371
    Abstract: A video interface apparatus for converting an incoming interlaced video signal to an outgoing non-interlaced video signal for an LCD flat panel with an arbitrary number of rows and columns. The incoming video signal is digitized and stored in a memory. An address generator creates addresses for reading and writing data from and into the memory, and the resulting read data is used to reconstruct the digital signal into an image for display on the LCD flat panel.
    Type: Grant
    Filed: September 27, 1993
    Date of Patent: August 15, 1995
    Assignee: Honeywell Inc.
    Inventors: David W. Miller, Larry A. Nelson, Ronald C. Robinder
  • Patent number: 5161729
    Abstract: Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at lest one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: November 10, 1992
    Assignee: Honeywell Inc.
    Inventors: Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks, Jerald M. Loy
  • Patent number: 5101550
    Abstract: A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: April 7, 1992
    Assignee: Honeywell Inc.
    Inventors: Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks
  • Patent number: 5099306
    Abstract: Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes.
    Type: Grant
    Filed: March 26, 1991
    Date of Patent: March 24, 1992
    Assignee: Honeywell Inc.
    Inventors: Thomas J. Dunaway, Richard K. Spielberger, Jerald M. Loy, Lori A. Dicks, Francis J. Belcourt
  • Patent number: 5074036
    Abstract: A method and apparatus for accurately positioning a semiconductor chip onto a die bond pad region of a semiconductor package. A frame is constructed for slidable contact with peripheral walls of a semiconductor package die cavity. A frame central aperture with a wide upper opening and a narrower lower opening guides a semiconductor chip dropped therethrough into a precise position in the die cavity.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: December 24, 1991
    Assignee: Honeywell Inc.
    Inventors: Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks
  • Patent number: 5066614
    Abstract: Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: November 19, 1991
    Assignee: Honeywell Inc.
    Inventors: Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks, Jerald M. Loy
  • Patent number: 5061822
    Abstract: Disclosed is a radial solution to integrated circuit chip carrier pitch deviation. The invention comprises a chip carrier comprising a carrier body with a plurality of fine pitch metalizations. Each of the metalizations includes an axis with an extension line that intersects a point common to all axes so that each metalization may be functionally utilized independent of carrier body shrinkage tolerances.
    Type: Grant
    Filed: March 23, 1990
    Date of Patent: October 29, 1991
    Assignee: Honeywell Inc.
    Inventor: Richard K. Spielberger
  • Patent number: 5043533
    Abstract: Disclosed is a cover for a semiconductor chip package. The cover comprises a sealing surface for providing a seal between the cover and a semiconductor chip package. A mounting surface for mounting a capacitor to the surface of cover is provided. The mounting surface comprises metalization including a metalized power pad and a metalized ground pad for mounting at least one capacitor on the surface of the cover.
    Type: Grant
    Filed: May 8, 1989
    Date of Patent: August 27, 1991
    Assignee: Honeywell Inc.
    Inventor: Richard K. Spielberger
  • Patent number: 5036163
    Abstract: Disclosed is a semiconductor chip package comprising a plurality of programmable pads located on a surface of the package, each pad being adapted for interconnection with a semiconductor chip. The package also includes a plurality of signal connectors located on a surface of the package. In addition, the package includes a plurality of signal connections, each signal connection providing an electrically conductive path between an individual programmable pad and a corresponding individual signal connector. A plurality of dedicated power or ground connectors are also located on a surface of the package. Conductive paths within the package provide apparatus for selectively connecting any programmable pad to a power or ground connector, any pad so connected also remaining connected to a corresponding signal connector.
    Type: Grant
    Filed: November 13, 1990
    Date of Patent: July 30, 1991
    Assignee: Honeywell Inc.
    Inventors: Richard K. Spielberger, Thomas J. Dunaway
  • Patent number: 4928806
    Abstract: A system and method is provided to remove a pallet from a moving transfer mechanism and for accurately locking the pallet at a precise location. More specifically, the system and method permits very accurate location, positioning, lifting and locking of a pallet to permit work station functions on devices carried by the pallets. The system is particularly well suited for non-synchronous assembly line operations.
    Type: Grant
    Filed: April 8, 1988
    Date of Patent: May 29, 1990
    Assignee: Honeywell Inc.
    Inventors: Edmund J. Anderson, Wayne P. Desrude
  • Patent number: 4675058
    Abstract: A method of manufacturing an LED including a substrate with an elevated surface portion, an epitaxial blocking layer adjacent thereto, and a double-heterojunction structure thereover.
    Type: Grant
    Filed: October 3, 1985
    Date of Patent: June 23, 1987
    Assignee: Honeywell Inc.
    Inventor: James L. Plaster
  • Patent number: 4670886
    Abstract: A repeater circuit for repeating data on a communication channel, the repeater circuit having two receiver/driver circuits arranged in repeating fashion and having a control circuit for maintaining the receiver/driver circuits in a listening mode, for switching one of the receiver/driver circuits to a transmitting mode when the other of the receiver/driver circuits receives data, and for maintaining the switched receiver/driver circuits switched by an amount of time required for the bus connected to the switched receiver/driver circuit to return to its normal state after the cessation of transmitted data.
    Type: Grant
    Filed: April 26, 1985
    Date of Patent: June 2, 1987
    Assignee: Honeywell Inc.
    Inventors: William R. Newcombe, Jr., Daniel G. Prysby, Michael E. Sanderson, David S. Schiller
  • Patent number: 4668102
    Abstract: A system for determining the flow rate and temperature of air moving through a duct including a sampling or sensing head for sampling the air moving through the duct, a flow rate sensor connected to the sensing head for providing an output signal relating to the flow rate of air moving through the duct based upon the sampling of that air, and a temperature sensor connected to the sensing head for determining the temperature of the air moving through the duct based upon the sampling of the air moving through the duct.
    Type: Grant
    Filed: May 8, 1985
    Date of Patent: May 26, 1987
    Assignee: Honeywell Inc.
    Inventor: Richard C. Mott
  • Patent number: 4667193
    Abstract: In a contention polling arrangement wherein polling messages are transmitted by a central controller for simultaneously polling a group of remote stations, the polling message contains an address which defines the entire range of remote stations to be polled and the remote stations will respond if their addresses fall between the address contained in the polling message and an address resulting from converting any trailing 0's of the address in the polling message to 1's.
    Type: Grant
    Filed: December 13, 1983
    Date of Patent: May 19, 1987
    Assignee: Honeywell, Inc.
    Inventors: Gary R. Cotie, Charles H. Culp, Daniel J. Dargis, John M. Mendala, Stephen C. Spielman
  • Urn
    Patent number: D395123
    Type: Grant
    Filed: April 17, 1997
    Date of Patent: June 9, 1998
    Inventor: Teresa P. Barretto