Abstract: The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic, silica or other plastic material is applied over a plastic packaged semiconductor device to seal the package from moisture.

Abstract: A chip-on-board assembly and a method of making is described in which semiconductor chips having center contacts are mounted active side down on the circuit board, with the center contacts centered in an elongated opening in the circuit board. The center contacts are connected through the openings in the circuit board to contacts on the circuit board on the opposite side of the circuit board on which the semiconductor chip is mounted. Semiconductor chips are alternately mounted on opposite sides of the circuit board to provide a higher placement density of semiconductor chips.