Abstract: A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).
Type:
Grant
Filed:
July 21, 1998
Date of Patent:
July 27, 1999
Assignee:
Motorola, Inc.
Inventors:
Steven Lewis Wille, Daniel Roman Gamota, Colleen Mary Walsh