Abstract: A disposable polish applying and buffing mitt comprising a multilayered mitt with a polish impervious layer removably attached to an impervious buffing mitt. A disposable polish applying and buffing mitt comprising a multilayered mitt with a sponge-like layer having an impervious backing removably attached to a buffing mitt. A disposable polish applying and buffing kit comprising a multilayered mitt with a first layer of polish impervious material removably secured to a second layer of polish impervious material forming a compartment therebetween which can hold a polish. The first layer of polish impervious material is removed from the second layer of polish impervious material to expose the polish for application. After the polish is applied to the object, the second layer of polish impervious material is removed to expose the buffing mitt.